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- Molded Interconnect Device (MID) - Global Strategic Business Report 2026 | Secure Share as Market Surges 141% to $5.3B by 2032; Benchmark Amphenol, HARTING, KYOCERA, Molex and TE ConnectivityCompanies: AmphenolTE ConnectivityMiniaturization, lower assembly costs and design flexibility fuel MID adoption across automotive, consumer electronics and healthcare