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Rigaku to Showcase Advanced X-ray Metrology and Inspection Solutions at SEMICON Taiwan 2026

Business Wire

– X-ray Technologies for Advanced Logic, HBM and Advanced Packaging in the AI Era –

HSINCHU, Taiwan, August 31, 2026--The Rigaku Group will exhibit at "SEMICON Taiwan 2026," taking place September 2 to 4, 2026, at TaiNEX 1 and 2 in Taipei.

SEMICON Taiwan is a leading international exhibition for the semiconductor industry. Taiwan is home to one of the world's leading semiconductor ecosystems and plays a central role in the manufacturing of advanced logic, high-bandwidth memory (HBM) and advanced packaging technologies. Rigaku continues to strengthen its presence in the region, following the opening of the Rigaku Technology Center Taiwan (RTC-TW) in 2025.

In response to the growing complexity of semiconductor manufacturing for advanced logic, HBM and advanced packaging, Rigaku will showcase advanced X-ray metrology and inspection solutions at SEMICON Taiwan 2026. Covering applications from R&D through high-volume manufacturing, these solutions support process control, materials characterization and non-destructive analysis for increasingly complex semiconductor devices and packages. Visitors can also meet with Rigaku specialists at the booth to discuss specific metrology, process control and analysis needs.

Product Highlights

  • XHENA AX-3000: Advanced X-ray inspection technology for 2.5D/3D packaging, designed to inspect hidden structures that are difficult to evaluate using conventional optical inspection alone. Featuring 3D laminography and automated defect identification, the system supports high-resolution, sub-micron defect detection of micro-bumps and through-silicon vias (TSVs) in CoWoS*1, HBM and hybrid bonding. It is currently available for customer evaluation.

  • XHEMIS WX-PLP310: New X-ray analyzer for panel-level packaging (PLP)*2 process control, available for customer evaluation. The system measures material composition and thin-film thickness across large substrates, supporting process control as advanced packaging shifts toward larger panel formats.

  • XTRAIA MF Series: The series features the flagship XTRAIA MF-3400, Rigaku's fourth-generation multifunctional X-ray metrology platform for high-throughput thin-film analysis, alongside the XTRAIA XD-3300 for high-precision measurement of advanced structures on ultra-small wafer pads.

  • ONYX Series: The series supports applications in advanced packaging, HBM, hybrid bonding and BEOL process control. It combines X-ray and optical technologies for fast, non-destructive characterization of complex multilayer structures.

    *1 CoWoS (Chip-on-Wafer-on-Substrate): An advanced packaging technology that integrates multiple chips in a single package.
    *2 Panel-level packaging (PLP): A packaging method using large, rectangular substrates instead of round wafers, enabling more chips per production run.

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