Press Release FeedGet the RSS feed
Menu

Search press releases

Every release here is real and links to its original. Filter by company, topic, language and date.

2,066 resultsPage 9 of 173, newest first
  1. AINetbox Labs partners with NVIDIA and Grafana Labs, announces new additions to the NetBox Infrastructure Intelligence Platform to Assemble the Intelligence Layer for AI Datacenter and Enterprise Infrastructure BuildoutsCompanies: NvidiaNetBox Labs announces partnerships with NVIDIA, Grafana Labs and slew of new product announcements for the NetBox Labs Infrastructure Intelligence Platform
  2. FinanceSunrise Realty Trust Announces ISS and Glass Lewis Support for Merger-Related ProposalsSunrise Realty Trust, Inc. (“SUNS” or the “Company”) (Nasdaq: SUNS), a lender on the Tannenbaum Capital Group (“TCG”) Real Estate platform, today announced that independent proxy advisory firms Institutional Shareholder Services Inc. (“ISS”) and Glass, Lewis & Co., LLC (“Glass Lewis”) each recommended that SUNS stockholders vote “FOR” both proposals at the Company’s October 23, 2026 special meeting of stockholders (the “Special Meeting”), consistent with the Company’s Board of Directors’ unanimous recommendation: (1) approval of the issuance of approximately 8,464,955 shares of SUNS common stock in connection with the Company’s proposed merger with Southern Realty Trust Inc. (“SRT”) (the “Merger”) (the “Stock Issuance Proposal”) and (2) adjournment of the Special Meeting, if necessary or appropriate, to solicit additional proxies in support of the Stock Issuance Proposal. ISS issued its recommendation on October 1, 2026, and Glass Lewis on October 6, 2026.
  3. FinanceSunrise Realty Trust Announces $20 Million Stock Repurchase ProgramSunrise Realty Trust, Inc. (“SUNS” or the “Company”) (Nasdaq: SUNS), a lender on the Tannenbaum Capital Group (“TCG”) Real Estate platform, today announced that on October 12, 2026, its Board of Directors (the “Board”) authorized a common stock repurchase program to repurchase up to $20.0 million of SUNS common stock through December 31, 2027 (the “Repurchase Program”). The Repurchase Program will become effective only upon closing of SUNS’ proposed merger with Southern Realty Trust Inc. (“SRT”) (the “Merger”), and no shares will be repurchased under the Repurchase Program before that time.
  4. AIRailtown AI Technologies Inc.Railtown AI Launches Conductr Agent Runtime, Unifying AI Agent Deployment, Data and ObservabilityRailtown AI Technologies Inc. (CSE: RAIL) (OTCQB: RLAIF) ("Railtown" or the "Company") today announced the launch of Conductr Agent Runtime, a new deployment capability within its Conductr platform designed to simplify how artificial intelligence (AI) agents are connected to data, deployed and managed in production.The launch represents an important advancement in Railtown's technology strategy, bringing together its existing...
  5. FinanceKincora Announces Shares for Debt SettlementVancouver, British Columbia, Oct 13, 2026 - Copper-gold explorer and hybrid project generator Kincora Copper Limited (ASX: KCC) (TSXV: KCC) (Kincora or the Company) is pleased to announce that the Company has entered into debt settlement agreements to settle an aggregate amount of C$319,437 of indebtedness (the "Debt") owing to certain current and former directors and members of management of the Company in connection with management and consulting fees accrued for the period from July 1, 2024 to June 30, 2026, through the issuance of an aggregate of 358,918 common shares in the capital of the Company (the "Settlement Shares") at a deemed price of C$0.89 per Settlement Share (the "Debt Settlement"). Kincora and Remuneration Committee chair, Mr Cameron McRae, commented, "A key and material element of the remuneration packages of the Kincora board and senior management has been in equity, looking to provide alignment and minimise the cash overheads of the Company. Each year Kincora has sought approval from shareholders for these remuneration structures, and today's settlement covers a two-year period ended June 2026 where the Company's circumstances, cash position and share prices have materially changed. The deemed price is in-line with both the contractual averages of the agreements over this period, current regulatory framework and is subject to shareholder approval at the upcoming AGM. A detailed Remuneration Committee review is ongoing seeking to reflect the Company's current and market conditions with further details to be provided in due course". The Settlement Shares issued pursuant to the Debt Settlement will be subject to a statutory four-month hold period, and completion of the Debt Settlement remains subject to disinterested shareholder approval and acceptance of the TSX Venture Exchange. No new control person or insider of the Company will be created as a result of the Debt Settlement. Certain of the Creditors are directors and/or officers of the Company. As such, the Debt Settlement constitutes a "related party transaction" within the meaning of Exchange Policy 5.9 - Protection of Minority Security Holders in Special Transactions and Multilateral Instrument 61-101 - Protection of Minority Security Holders in Special Transactions ("MI 61-101"). The Debt Settlement is exempt from the formal valuation and minority shareholder approval requirements of MI 61-101 pursuant to subsections 5.5(a) and 5.7(1)(a) thereof, as neither the fair market value of the indebtedness settled nor the fair market value of the Settlement Shares to be issued exceeds 25% of the Company's market capitalization. Notwithstanding the foregoing, in accordance with Exchange Policy 4.4 - Security Based Compensation, disinterested shareholder approval is required for the settlement of compensation owed to non-arm's length parties through the issuance of securities where the aggregate amount of such indebtedness exceeds C$10,000 per month. Accordingly, the Debt Settlement is subject to disinterested shareholder approval. The Company intends to seek such approval at its upcoming Annual and Special Meeting of Shareholders (the "Meeting"), scheduled for November 19, 2026. Additional information regarding the Debt Settlement will be included in the Management Information Circular for the Meeting, which will be filed under the Company's profile on SEDAR+ (at www.sedarplus.ca), on the Australian Securities Exchange ("ASX") platform (at www.asx.com.au) and the Company's website (at www.kincoracopper.com). About Kincora Kincora Copper Limited (ASX: KCC) (TSXV: KCC) is an emerging Australia-focused gold-copper explorer with a hybrid project generator strategy. The Company is successfully proving up the prospectivity of its extensive project portfolio, which includes multiple district-scale landholdings and scalable drill ready targets. These assets are located in Australia's Lachlan Fold Belt, one of the globe's leading porphyry belts, and the historical Condobolin mining field within the Cobar basin in NSW. The Company has already unlocked over A$100 million of potential partner funding for multiple earlier stage and/or non-core porphyry projects. These initial deals have supported over 20,000 metres of drilling and over A$10m of partner funded exploration since late 2024, with management fees and exploration ramping up. Various partner discussions are ongoing for its remaining 100% owned flagship and advanced exploration stage porphyry projects. By having a significant portfolio of partner funded large porphyry projects, and a very focused capital efficient programs at the Condobolin and other sole funded projects, the Company is seeking to position Kincora as a leading institutional grade explorer in the public Australian and Canadian markets, and the leading project generator on the ASX. The Company's website is: www.kincoracopper.com FOR FURTHER INFORMATION, PLEASE CONTACT: Sam Spring, President and Chief Executive Officer [email protected] or +61431 329 345 Executive office 400 - 837 West Hastings Street Vancouver, BC V6C 3N6, Canada Tel: 1.604.283.1722Kaitlin Taylor, Investor Relations [email protected] Subsidiary office Australia C/- JM Corporate Services Level 6, 350 Collins Street Melbourne, VIC, Australia 3000 This announcement has been authorised for release by the Board of Kincora Copper Limited (ARBN 645 457 763) Forward-Looking Statements Certain information regarding Kincora contained herein may constitute forward-looking statements and "forward looking information" within the meaning of applicable securities laws (collectively, "forward-looking information"). Forward-looking information is generally identifiable by the use of words "believes", "may", "plans", "will", "anticipates", "Intends", "could", "estimates", "expects", "forecasts", "projects", and similar expressions, and the negative of such expressions. Such forward-looking statements or information include but are not limited to statements or information with respect to: the completion of the Debt Settlement; the issuance of the Settlement Shares; the receipt and timing of disinterested shareholder approval and acceptance of the TSX Venture Exchange; the Company's planned exploration programs; the availability, timing and amount of potential partner funding; anticipated partner-funded exploration activities and management fee income; the outcome of partner discussions; the Company's ability to advance its project portfolio and exploration targets; and the Company's strategy and objective of positioning itself as a leading institutional-grade explorer in the Australian and Canadian public markets and a leading project generator on the ASX. Forward-looking statements may include estimates, plans, expectations, opinions, forecasts, projections, guidance or other statements that are not statements of fact. Readers are cautioned not to place undue reliance on forward-looking information and statements. Forward-looking information involves numerous risks and uncertainties, and actual results might differ materially from results suggested in any forward-looking information. These risks and uncertainties include, among other items: market prices, exploitation and exploration results, continued availability of capital and financing and general economic, market, or business conditions. Although Kincora believes that the expectations reflected in such forward-looking statements are reasonable, it can give no assurance that such expectations will prove to have been correct. Kincora cautions that actual performance will be affected by a number of factors, most of which are beyond its control, and that future events and results may vary substantially from what Kincora currently foresees. Factors that could cause actual results to differ materially from those in forward-looking statements include: market prices; exploitation and exploration results; continued availability of capital and financing and general economic; market or business conditions; and investor sentiment. Accordingly, readers should not place undue reliance on forward-looking information and statements. Readers are cautioned that reliance on such information and statements may not be appropriate for other purposes. The forward-looking statements are expressly qualified in their entirety by this cautionary statement. The information contained herein is stated as of the current date and is subject to change after that date. Kincora does not assume the obligation to revise or update these forward-looking statements, except as may be required under applicable securities laws. Neither the TSX Venture Exchange nor its Regulation Services Provider (as that term is defined in the policies of the TSX Venture Exchange) or the Australian Securities Exchange accepts responsibility for the adequacy or accuracy of this release.
  6. FinanceDigi Power X Inc.Digi Power X Announces $200 Million Debt Financing Commitment to Support Completion of Alabama AI Data Center and Provides Expansion UpdateMIAMI BEACH, FL, Oct 13, 2026 - Digi Power X Inc. (Nasdaq:DGXX)(Cboe Canada:DGX) ("Digi Power X" or the "Company"), an AI data center infrastructure operator, today announced that it has received a commitment letter from a major lending institution for US$200 million in debt financing to support the development of its 40 MW AI data center in Columbiana, Alabama. The financing, syndicated by Goldman Sachs, is expected to close within 90 days, subject to definitive documentation and satisfaction of various conditions, including the lender's completion of its diligence efforts. The financing is to be structured at a project special purpose vehicle ("SPV") level, with an unsecured Company guarantee through project completion and other limited matters. Proceeds are intended to support completion of the Alabama project and related project costs, helping preserve corporate liquidity, mitigate shareholder dilution and position the Company to pursue additional customer contracts. "This financing commitment is an important step toward completing our Alabama campus while limiting dilution for our shareholders. We are progressing from infrastructure development toward revenue generation, with construction on schedule in Alabama, our first modular GPU deployment operating successfully, and expansion plans advancing across our portfolio." - Michel Amar, Chairman & Chief Executive Officer, Digi Power X Inc. Financial Position and Alabama Construction Update As of the date hereof, Digi Power X held approximately US$135 million in cash and invested approximately US$153 million in capital expenditures year to date in 2026. The Company did not issue any shares under its at-the-market ("ATM") equity offering program during the third quarter of 2026, resulting in no ATM-related shareholder dilution during the quarter. Construction at the 40 MW Alabama campus remains on target, with Phase 1 expected to be completed in December 2026 and Phase 2 in March 2027. ARMS 200 Operations and Supermicro Partnership The Company's first ARMS 200 modular data center has been operating successfully since May 2026, supporting its GPU bare-metal business. The deployment demonstrates Digi Power X's ability to manage the infrastructure supporting these services, including power, cooling, data center operations and GPU systems. Digi Power X's partnership with Super Micro Computer, Inc. ("Supermicro") supports dedicated, bare-metal access to NVIDIA Blackwell GPUs, enabling customers to deploy AI workloads without building or managing the underlying infrastructure themselves. Supermicro recently highlighted the collaboration publicly, underscoring its role in powering Digi Power X's full-stack AI offering. Digi Power X: Expanding the AI Token Factory Through NeoCloudz Digi Power X plans to expand its AI token factory infrastructure through its NeoCloudz platform, using the proprietary ARMS modular data center systems of US Data Center, Inc., a subsidiary of which the Company is the largest shareholder, to support fast deployment. This expansion is intended to support the Company's planned growth in GPU bare-metal services and AI token generation. Building on its initial ARMS 200 deployment, the Company intends to deploy additional modular capacity to meet customer demand and grow recurring AI infrastructure revenue. "We're excited to unveil our AI token factory at NVIDIA GTC Berlin. Digi Power X owns the whole stack, from the power to the data center to the computer, and that's how we deliver fast, affordable inference at scale." - Alec Amar, President, Digi Power X Inc. New York Transition to AI Token Factories Digi Power X is in the planning phase to repurpose its New York State sites into AI token factories, expanding capacity for GPU bare-metal services and AI token generation. The planned conversion is designed to reduce site noise levels and incorporate closed-loop cooling systems designed to minimize water consumption by recirculating coolant without routine evaporative water use. Silicon Valley Development Lab The Company has also acquired an office and laboratory facility in Silicon Valley to develop the technology and operational intelligence supporting its AI token factory strategy. Digi Power X is bringing together top talent in engineering, artificial intelligence and software development to accelerate innovation and strengthen its capabilities as it expands its GPU infrastructure and AI services. About Digi Power X Digi Power X is a fully integrated AI infrastructure company that owns and operates the whole stack, from power generation and data centers to the computers that run AI workloads. The Company offers colocation for enterprise and hyperscale customers, bare metal GPU rental and a token factory that delivers AI inference at scale. Because it controls the power, the infrastructure and the compute, Digi Power X can bring capacity online faster and more affordably. For more information, visit www.digipowerx.com. Investor Relations For further information, please contact: Michel Amar, Chief Executive Officer Digi Power X Inc. www.digipowerx.com Investor Relations: T: 888-474-9222 | Email: [email protected] Cautionary Statement Trading in the securities of the Company should be considered highly speculative. No stock exchange, securities commission or other regulatory authority has approved or disapproved the information contained herein. Cboe Canada does not accept responsibility for the adequacy or accuracy of this release. Cautionary Note and Forward-Looking Statements This press release contains "forward-looking statements" within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995, and "forward-looking information" within the meaning of applicable Canadian securities laws (collectively, "forward-looking statements"). All statements other than statements of historical fact are forward-looking statements. Words such as "anticipate," "believe," "continue," "estimate," "expect," "intend," "may," "plan," "potential," "proposed," "should," "target," "will," "would" and similar expressions are intended to identify forward-looking statements, although not all forward-looking statements contain these words. Forward-looking statements in this press release include, without limitation, statements regarding: the proposed $200 million debt financing, including the timing of closing and funding, and the satisfaction of conditions to closing, including lender satisfaction of its diligence requirements; the expected use of proceeds, including the funding of remaining construction and related project costs, and the anticipated effects on corporate liquidity and shareholder dilution; the progress, schedule and completion of Phase 1 and Phase 2 of the Company's 40 MW AI data center in Columbiana, Alabama, the Company's ability to pursue additional customer contracts and generate recurring revenue; the planned expansion of the Company's AI token factory infrastructure, including through USDC and the ARMS modular data center platform; the planned conversion of the Company's New York State sites and the anticipated noise and water use benefits of that conversion; the anticipated use and benefits of the Company's Silicon Valley facility; and the execution of the Company's AI infrastructure strategy. These statements are based on management's current expectations, estimates and assumptions and are subject to known and unknown risks, uncertainties and other factors that could cause actual results to differ materially, including, among others: the risk that the conditions to closing under the commitment letter are not satisfied or waived on a timely basis or at all, or that the financing is not completed on the anticipated terms or at all; the risk that the lender's commitment terminates or is modified; the possibility that financing proceeds will be insufficient to fund all remaining construction and project costs; the risk that preliminary financial information differs from final reported results; construction delays, cost overruns, supply chain disruptions and the availability of equipment, GPUs, labor and power; permitting, zoning, environmental and other regulatory approvals; the performance of contractors, partners and counterparties; the ability of the Company and its customers to perform under the Company's colocation and other customer agreements; obligations under the financing; demand for AI and high-performance computing infrastructure; general economic, market and interest rate conditions; and the other risks and uncertainties described under "Risk Factors" in the Company's most recent Annual Report on Form 10-K and other filings with the U.S. Securities and Exchange Commission. Readers are cautioned not to place undue reliance on forward-looking statements, which speak only as of the date of this press release. Except as required by applicable law, the Company undertakes no obligation to update or revise any forward-looking statement, whether as a result of new information, future events or otherwise. SOURCE: Digi Power X Inc.
  7. AIAutumn Electronics Fair and electronicAsia open today bringing global buyers to Hong KongHong Kong, Oct 13, 2026 - The Hong Kong Electronics Fair (Autumn Edition), organised by the Hong Kong Trade Development Council (HKTDC), and electronicAsia, jointly organised by the HKTDC and MMI Asia Pte Ltd, opened today at the Hong Kong Convention and Exhibition Centre. Running for four consecutive days, the twin fairs showcase a broad spectrum of innovations spanning consumer electronics, artificial intelligence (AI), robotics technologies, smart living, immersive entertainment, electronic components and advanced manufacturing technologies, providing global buyers with a one-stop sourcing and networking platform. Making its debut this year, the Future Industries Zone spotlights five frontier sectors and showcases emerging trends shaping the industries of tomorrow. The Autumn Electronics Fair and eAsia opened today at the Hong Kong Convention and Exhibition Centre, where the fairs will run for four consecutive days Speaking at the opening ceremony for the Future Industries Zone this morning, Sophia Chong, HKTDC Executive Director, said: "The Future Industries Zone reflects our commitment to evolve our fairs alongside the industry, while supporting the strategic direction set out in the Policy Address and the First Five-Year Plan to develop Hong Kong into an international innovation and technology centre. This year's Hong Kong Electronics Fair (Autumn Edition) and electronicAsia are bringing together over 3,200 exhibitors from 15 countries and regions. Another key highlight is the expanded RoboPark that showcases not only the latest robotics technologies, but also their growing applications in everyday life and across industries. The HKTDC is one of the core members of the government-led GoGlobal Task Force and we will make good use of one of the world's leading marketplaces to feature the GoGlobal Connect Zone, which offers advisory services and practical support to help enterprises - particularly those from the Chinese Mainland - expand internationally through Hong Kong. The zone reflects the HKTDC's commitment to reinforcing Hong Kong's role as a platform for global expansion, capitalising on its strengths as a superconnector and super value-adder." Sophia Chong, Executive Director of the Hong Kong Trade Development Council, delivers remarks at the opening ceremony for the Future Industries Zone The Autumn Electronics Fair has introduced the new Future Industries Zone this year, with an opening ceremony held this morning. Kevin Choi, Permanent Secretary for Innovation, Technology and Industry of HKSARG (front row, fourth from left); Sophia Chong, Executive Director of the Hong Kong Trade Development Council (front row, fourth from right); and Paul So, Chairman of the Hong Kong Electronic Industries Association (front row, third from left), joined the event with other distinguished guests In addition to Hong Kong exhibitors, the fairs feature exhibitors from the Chinese Mainland, Macao and Taiwan, as well as countries across the Asia-Pacific region including Korea and Singapore. Exhibitors from Europe and other overseas markets, including Denmark, the United Kingdom, Germany, Switzerland, Spain and Cyprus, are also participating, showcasing a wide range of the latest electronics products and advanced technologies. On the opening day of the fairs, buyers from around the world gathered to explore sourcing opportunities. The HKTDC has organised 130 buying missions comprising buyers from 65 countries and regions to visit and source at the fairs, further reinforcing Hong Kong's role as a platform connecting international markets with innovative supply chains. Future Industries Zone debuts, showcasing synergies across five key themes In support of the Government's drive to develop Hong Kong into an international innovation and technology centre and deepen AI development and adoption in the city, this year's Autumn Electronics Fair has launched the new Future Industries Zone, jointly organised by the HKTDC and the Hong Kong Electronic Industries Association (HKEIA) and supported by the Innovation, Technology and Industry Bureau of the Hong Kong SAR Government. Led by major innovation and technology institutions, including Cyberport, the Hong Kong Science and Technology Parks Corporation and the Hong Kong Productivity Council, the zone focuses on five key themes: Future Computing, Future Manufacturing, Future Marine & Quantum Technologies, Future Microelectronics and Future Wellness. The newly launched Future Industries Zone at the Autumn Electronics Fair focuses on five key themes: Future Computing, Future Manufacturing, Future Marine & Quantum Technologies, Future Microelectronics and Future Wellness Bringing together more than 100 exhibitors, the Future Industries Zone showcases cutting-edge technologies and innovative application solutions. The zone also features a series of thematic forums and networking events, welcoming representatives from government, industry, academia, research and investment sectors to explore opportunities in future industry development. A distinguished lineup of speakers has been invited to share insights on emerging technologies and industry trends. At a thematic forum to be held tomorrow (14 October), experts and representatives from leading global companies and organisations, including AWS, IBM, Lenovo and HPE, will share insights into global trends in cross-industry business transformation and innovation-driven technology development. Other activities also feature a distinguished lineup of speakers, including Prof Wang Yang, Vice-President of The University of Hong Kong; Dr Wang Jun, Deputy Executive President of the Bank of China Group Investment Limited; and He Jun, Vice-President of TCL Industries Holdings Co., Ltd. They will share their professional insights on technology innovation, industrial development and emerging opportunities. GoGlobal Connect Zone offers professional service matching for enterprises As a member of the Government's GoGlobal Task Force, the HKTDC has established a dedicated GoGlobal Connect Zone at the Autumn Electronics Fair. This brings together professional service providers from the finance, legal, accounting and insurance sectors to assist businesses in areas such as financing, intellectual property, logistics, compliance and risk management, helping Chinese Mainland enterprises connect with international markets through Hong Kong’s professional services platform. The fair features a series of GoGlobal activities, including the "GoGlobal: Scaling Smart Consumer Innovations Worldwide" seminar at which representatives from Hang Seng Bank, the Hong Kong Export Credit Insurance Corporation and other industry and financial organisations will share insights on key strategies for overseas expansion The fairs also feature a series of forums focusing on overseas market expansion. Representatives from OCBC Bank will share insights tomorrow afternoon (14 October) on the manufacturing ecosystem in the ASEAN bloc, helping companies interested in entering markets in these countries better understand the region's economic environment, tax regimes, market trends and business development opportunities. Over 120 robots highlight real-world applications of robotics technologies This year's Autumn Electronics Fair focuses on the latest consumer electronics products and innovative technologies under three highlighted themes: AI & Robotics, Smart Wellness and NEXTEntertainment. Related products are featured across different thematic zones throughout the exhibition. More than 120 robots are showcased at this year's fair, primarily within RoboPark, demonstrating applications across four key areas: Commercial & Services, Industrial & Logistics, Entertainment & Social, and Healthcare & Rehabilitation. Highlights include AgiBot Innovation (Shanghai) Technology Co., Ltd (Booth: 3CON-R31) and its full-sized humanoid robot Agibot A3; UBTECH (Booth: 3CON-R27), one of the "Shenzhen Eight Great Guardians", which is exhibiting its next-generation full-sized humanoid robot Walker C1, developed for urban coexistence; and DEEP Robotics (Booth: 3CON-R19), one of the "Hangzhou Six Little Dragons", displaying its quadruped robots Lite3 and M20. Other renowned exhibitors include the Shenzhen Honor Smart Technology Development Co., Ltd. (Booth: 3CON-R37), whose humanoid robot was the winner of the 2026 Beijing E-Town Half Marathon, and Booster Robotics (Booth: GH-R13), champion of the 2026 RoboCup. A number of well-known technology companies from the "Shenzhen Eight Great Guardians" and "Hangzhou Six Little Dragons" are also showcasing their latest innovations, including AI² Robotics (Booth: GH-Q01), Digit (Booth: 3CON-R49), EngineAI (Booth: 3CON-R52) and first-time exhibitor DexForce (Booth: GH-R07). The fair features several leading technology companies, including Booster Robotics (Booth: GH-R13), champion of the 2026 RoboCup, which showcases its latest innovations and technological achievements RoboPark features multiple demonstration and experience zones, enabling buyers to explore how robotics technologies are being integrated into industries and everyday life. They include the RoboDog Garden, showcasing robotic dogs; the Robot Dance Battle, featuring dance performances by robots; and the Coffee & Popcorn Station, where robots prepare snacks and drinks, allowing visitors to experience the practical application potential of robotics at first hand. RoboPark features multiple interactive experience and demonstration zones. At the "Coffee & Popcorn Station", robots prepare snacks and drinks for visitors New products highlight AI integration across healthcare, lifestyle and entertainment Smart Wellness encompasses digital health devices, smart wearables, personal care technologies, gerontech and healthy living electronics, reflecting strong market demand for technology-enabled health management and improved quality of life. Smart Wellness is another key focus of the Autumn Electronics Fair, with exhibitors showcasing innovative solutions ranging from digital health devices and smart wearables to personal care technologies, gerontech and healthy living electronics. Many exhibitors are leveraging the fair as a platform to showcase newly introduced products. Future Access Technology Co., Limited (Booth: 1C-D06) is presenting the LYRA, a screen-free smart wristband designed to minimise distractions and help users focus on daily life activities while supporting personalised fitness programmes and more than 170 sports modes. Cheung Shing Development (H.K.) Limited (Booth: 3D-E06) is displaying its latest Hearing Aid Glasses for people with mild to moderate hearing loss. Equipped with sound amplification technology, the glasses improve speech clarity in noisy environments and enhance communication experiences. NEXTEntertainment features extended reality (XR) technologies, smart gaming devices, digital content creation tools, AI-powered entertainment solutions and innovative consumer electronics designed to enhance both entertainment experiences and digital content creation. Among the highlights, DreamGear LLC (Booth: 1D-C09) is showcasing a new rechargeable retro gaming console featuring more than 200 built-in classic games, smart backlit button prompts and multiple control modes, combining nostalgic arcade gaming with modern innovation. The Autumn Electronics Fair features more than 20 exhibition zones. The Hall of Fame brings together over 560 renowned brands, including first-time exhibitors Aoni (Booth: 1A-D02) and HEAD (Booth: 1C-A12). RISE Avenue highlights emerging brands including Beijing Huahon Data Technology Co., Ltd. (Booth: 1CON-003), which is making its global debut with the All-in-One Liquid-Cooled AI Computing System, providing powerful computing capabilities for large-model training, AI inference and visual rendering through advanced liquid-cooling technology. The Adventure Hub features the Immersive Experience Zone, showcasing the latest applications of XR technologies, brain-computer interfaces and other creative technologies. Highlights include a brainwave-controlled claw machine from Yugu Technology (Booth: 5E-D12). Meanwhile, the Tech Hall focuses on AI, professional data and Internet of Things (IoT) solutions. Among the exhibitors, Guangzhou Quwan Network Technology Co., Ltd (Booth: CH-H10) is presenting the TemPolor Melo-D Generative AI Guitar, which integrates AI into music creation. Users simply upload their favourite songs and the system generates fingerstyle melodies while providing illuminated guidance on the guitar body and display screen to assist performance. More than 120 start-ups connecting with opportunities The fairs also bring together more than 120 promising young enterprises and start-ups, primarily in the Startup Zone. The IOT HK Association Limited and JimHang Academy are each leading groups of start-ups showcasing technologies and solutions designed to address real-world business challenges. A range of supporting activities will also be held, including investment matching sessions, the Hong Kong Value Creation for Technology: Pitching Competition and mentorship programmes, helping start-ups refine their business models, expand investor networks and strengthen their market competitiveness. The fair brings together more than 120 promising young enterprises and start-ups, primarily showcased within the Startup Zone electronicAsia connects the electronics supply chain Held concurrently with the Autumn Electronics Fair, electronicAsia (eAsia) features multiple thematic zones covering electronic components, display technologies, printed circuit boards and electronic manufacturing services, as well as testing and measurement instruments. Together, the two fairs create a comprehensive one-stop sourcing platform spanning the entire electronics industry supply chain. eAsia features a wide range of electronic components, display technologies, printed circuit boards, electronics manufacturing services and testing instruments, forming a one-stop sourcing platform together with the Autumn Electronics Fair Among the exhibitors at eAsia, Rapid Conn (S) Pte. Ltd. (Booth: 5B-C10) is showcasing advanced interconnect solutions, while Surface Mount Technology Ltd. (Booth: 5B-D01) is presenting cutting- edge AI and AIoT solutions. The fairs also feature a rich programme of forums and seminars. The 11th Symposium on Innovation & Technology, jointly organised by HKTDC and the Hong Kong Electronics and Technologies Association, takes place today under the theme "AI-Driven Security & The Next-Gen Infrastructure". Speakers include Alexander Gerfer, Chief Technology Officer of Würth Elektronik Group; Dr Charles Cheung, Adjunct Associate Professor in the Department of Mathematics at Hong Kong Baptist University; and Silvia Ihensekhien, Chief Security Advisor, Greater China at Microsoft. The Symposium on Innovation & Technology, jointly organised by HKTDC and the Hong Kong Electronics and Technologies Association, takes place today under the theme "AI-Driven Security & The Next-Gen Infrastructure" In addition, the Hong Kong Electronic Forum, jointly organised by the HKTDC, MMI Asia Pte Ltd and the Hong Kong Electronic Industries Association, with support from the Electronics Division of The Hong Kong Institution of Engineers, will be held on 15 October under the theme "Future Tech: Powering Electronics Competitiveness with AI and Sustainable Innovation", exploring how AI, sustainability and technological innovation are reshaping the future of the electronics sector. Under the EXHIBITION+ hybrid model, exhibitors and buyers can meet online through the HKTDC Click2Match smart business matching platform in addition to attending the physical fairs. The online exhibitions for the Hong Kong Electronics Fair (Autumn Edition) and electronicAsia run from 6 to 23 October. Photo download: https://bit.ly/4AVhNOu Websites - Hong Kong Electronics Fair (Autumn Edition): https://www.hktdc.com/event/hkelectronicsfairae/en- electronicAsia: https://www.hktdc.com/event/electronicasia/en Media enquiries Please contact the HKTDC’s Communications & Public Affairs Department: Katy Wong Tel: (852) 2584 4524 Email: [email protected] Clayton Lauw Tel: (852) 2584 4472 Email: [email protected] HKTDC Media Room: https://mediaroom.hktdc.com/en About HKTDC The Hong Kong Trade Development Council (HKTDC) celebrates its 60th anniversary this year. The HKTDC is a statutory body established in 1966 to promote, assist and develop Hong Kong's trade. With over 50 offices globally, including 13 in the Chinese Mainland, the HKTDC promotes Hong Kong as a two-way global investment and business hub. The HKTDC organises international exhibitions, conferences and business missions to create business opportunities for companies, particularly small and medium-sized enterprises (SMEs), in the mainland and international markets. The HKTDC also provides up-to-date market insights and product information via trade publications, research reports and digital news channels. For more information, please visit: www.hktdc.com/aboutus.
  8. AIH3C CAS Named a Visionary in Gartner(R) Magic Quadrant(TM) for Server Virtualization PlatformsBEIJING, Oct 13, 2026 - On September 14, Gartner released its Magic Quadrant™ for Server Virtualization Platforms. H3C CAS is positioned as a Visionary in the 2026 Gartner® Magic Quadrant™ for Server Virtualization Platforms, making H3C one of the few Chinese vendors included in the report. This recognition reflects H3C CAS's continued innovation and capabilities in server virtualization. Beyond Virtualization: A Stable Foundation for Mission-Critical Workloads As cloud computing continues to evolve, server virtualization remains a key foundation for enterprise IT infrastructure. At the same time, the growth of AI, diverse computing architectures, and the coexistence of virtual machines and containers are creating new requirements for virtualization platforms. H3C CAS has evolved from a compute virtualization platform into an enterprise virtualization and cloud management platform covering compute, storage, networking, security, and unified management. It supports x86, ARM, and a broad range of operating systems and hardware. Key capabilities include: 1. Improved resource utilization with NVMe SSD-based intelligent memory overcommitment. 2. Optimized VM scheduling with automatic VM NUMA binding. 3. Support for AI workloads with capabilities such as vGPU live migration. From Virtual Machines to Containers: One Platform for Application Modernization As virtual machines and containers increasingly coexist in enterprise data centers, organizations need a unified infrastructure platform to support both traditional and cloud-native applications. H3C CAS integrates virtualization and cloud-native technologies through native Kubernetes integration and container cluster services, enabling unified management of VM and container resources. CAS also provides virtual networking and network services, including Open vSwitch, bandwidth management, traffic prioritization, firewalls, load balancing, and micro-segmentation. Support for RoCE v2 and SR-IOV further enables high-performance and AI workloads. Evolving Virtualization for the AI Era As IT infrastructure evolves from server virtualization to cloud and AI infrastructure, enterprises continue to require stable, secure, efficient, and future-ready platforms. The Visionary positioning in the Gartner Magic Quadrant reflects the global competitiveness of H3C CAS in server virtualization. Today, CAS serves more than 15,000 customers, with 500,000+ CPUs running online, across industries including government, finance, education, and broadcasting and television. Looking ahead, H3C will continue to integrate server virtualization with AI computing, GPU resource management, and cloud-native technologies, helping customers build more efficient and intelligent infrastructure for next-generation data centers. Disclaimer: Source:Gartner, Magic Quadrant for Server Virtualization Platforms, 14 September 2026 GARTNER and Magic Quadrant are registered trademarks of Gartner, Inc. and/or its affiliates in the U.S. and internationally and are used herein with permission. All rights reserved. Gartner does not endorse any vendor, product or service depicted in its research publications, and does not advise technology users to select only those vendors with the highest ratings or other designation. Gartner research publications consist of the opinions of Gartner's research organization and should not be construed as statements of fact. Gartner disclaims all warranties, expressed or implied, with respect to this research, including any warranties of merchantability or fitness for a particular purpose. H3C Jingwen Zeng [email protected] https://www.h3c.com/en/
  9. AIAutumn Electronics Fair and electronicAsia open today bringing global buyers to Hong KongHong Kong, Oct 13, 2026 - The Hong Kong Electronics Fair (Autumn Edition), organised by the Hong Kong Trade Development Council (HKTDC), and electronicAsia, jointly organised by the HKTDC and MMI Asia Pte Ltd, opened today at the Hong Kong Convention and Exhibition Centre. Running for four consecutive days, the twin fairs showcase a broad spectrum of innovations spanning consumer electronics, artificial intelligence (AI), robotics technologies, smart living, immersive entertainment, electronic components and advanced manufacturing technologies, providing global buyers with a one-stop sourcing and networking platform. Making its debut this year, the Future Industries Zone spotlights five frontier sectors and showcases emerging trends shaping the industries of tomorrow. The Autumn Electronics Fair and eAsia opened today at the Hong Kong Convention and Exhibition Centre, where the fairs will run for four consecutive days Speaking at the opening ceremony for the Future Industries Zone this morning, Sophia Chong, HKTDC Executive Director, said: "The Future Industries Zone reflects our commitment to evolve our fairs alongside the industry, while supporting the strategic direction set out in the Policy Address and the First Five-Year Plan to develop Hong Kong into an international innovation and technology centre. This year's Hong Kong Electronics Fair (Autumn Edition) and electronicAsia are bringing together over 3,200 exhibitors from 15 countries and regions. Another key highlight is the expanded RoboPark that showcases not only the latest robotics technologies, but also their growing applications in everyday life and across industries. The HKTDC is one of the core members of the government-led GoGlobal Task Force and we will make good use of one of the world's leading marketplaces to feature the GoGlobal Connect Zone, which offers advisory services and practical support to help enterprises - particularly those from the Chinese Mainland - expand internationally through Hong Kong. The zone reflects the HKTDC's commitment to reinforcing Hong Kong's role as a platform for global expansion, capitalising on its strengths as a superconnector and super value-adder." Sophia Chong, Executive Director of the Hong Kong Trade Development Council, delivers remarks at the opening ceremony for the Future Industries ZoneThe Autumn Electronics Fair has introduced the new Future Industries Zone this year, with an opening ceremony held this morning. Kevin Choi, Permanent Secretary for Innovation, Technology and Industry of HKSARG (front row, fourth from left); Sophia Chong, Executive Director of the Hong Kong Trade Development Council (front row, fourth from right); and Paul So, Chairman of the Hong Kong Electronic Industries Association (front row, third from left), joined the event with other distinguished guests In addition to Hong Kong exhibitors, the fairs feature exhibitors from the Chinese Mainland, Macao and Taiwan, as well as countries across the Asia-Pacific region including Korea and Singapore. Exhibitors from Europe and other overseas markets, including Denmark, the United Kingdom, Germany, Switzerland, Spain and Cyprus, are also participating, showcasing a wide range of the latest electronics products and advanced technologies. On the opening day of the fairs, buyers from around the world gathered to explore sourcing opportunities. The HKTDC has organised 130 buying missions comprising buyers from 65 countries and regions to visit and source at the fairs, further reinforcing Hong Kong's role as a platform connecting international markets with innovative supply chains. Future Industries Zone debuts, showcasing synergies across five key themes In support of the Government's drive to develop Hong Kong into an international innovation and technology centre and deepen AI development and adoption in the city, this year's Autumn Electronics Fair has launched the new Future Industries Zone, jointly organised by the HKTDC and the Hong Kong Electronic Industries Association (HKEIA) and supported by the Innovation, Technology and Industry Bureau of the Hong Kong SAR Government. Led by major innovation and technology institutions, including Cyberport, the Hong Kong Science and Technology Parks Corporation and the Hong Kong Productivity Council, the zone focuses on five key themes: Future Computing, Future Manufacturing, Future Marine & Quantum Technologies, Future Microelectronics and Future Wellness. The newly launched Future Industries Zone at the Autumn Electronics Fair focuses on five key themes: Future Computing, Future Manufacturing, Future Marine & Quantum Technologies, Future Microelectronics and Future Wellness Bringing together more than 100 exhibitors, the Future Industries Zone showcases cutting-edge technologies and innovative application solutions. The zone also features a series of thematic forums and networking events, welcoming representatives from government, industry, academia, research and investment sectors to explore opportunities in future industry development. A distinguished lineup of speakers has been invited to share insights on emerging technologies and industry trends. At a thematic forum to be held tomorrow (14 October), experts and representatives from leading global companies and organisations, including AWS, IBM, Lenovo and HPE, will share insights into global trends in cross-industry business transformation and innovation-driven technology development. Other activities also feature a distinguished lineup of speakers, including Prof Wang Yang, Vice-President of The University of Hong Kong; Dr Wang Jun, Deputy Executive President of the Bank of China Group Investment Limited; and He Jun, Vice-President of TCL Industries Holdings Co., Ltd. They will share their professional insights on technology innovation, industrial development and emerging opportunities. GoGlobal Connect Zone offers professional service matching for enterprises As a member of the Government's GoGlobal Task Force, the HKTDC has established a dedicated GoGlobal Connect Zone at the Autumn Electronics Fair. This brings together professional service providers from the finance, legal, accounting and insurance sectors to assist businesses in areas such as financing, intellectual property, logistics, compliance and risk management, helping Chinese Mainland enterprises connect with international markets through Hong Kong’s professional services platform. The fair features a series of GoGlobal activities, including the "GoGlobal: Scaling Smart Consumer Innovations Worldwide" seminar at which representatives from Hang Seng Bank, the Hong Kong Export Credit Insurance Corporation and other industry and financial organisations will share insights on key strategies for overseas expansion The fairs also feature a series of forums focusing on overseas market expansion. Representatives from OCBC Bank will share insights tomorrow afternoon (14 October) on the manufacturing ecosystem in the ASEAN bloc, helping companies interested in entering markets in these countries better understand the region's economic environment, tax regimes, market trends and business development opportunities. Over 120 robots highlight real-world applications of robotics technologies This year's Autumn Electronics Fair focuses on the latest consumer electronics products and innovative technologies under three highlighted themes: AI & Robotics, Smart Wellness and NEXTEntertainment. Related products are featured across different thematic zones throughout the exhibition. More than 120 robots are showcased at this year's fair, primarily within RoboPark, demonstrating applications across four key areas: Commercial & Services, Industrial & Logistics, Entertainment & Social, and Healthcare & Rehabilitation. Highlights include AgiBot Innovation (Shanghai) Technology Co., Ltd (Booth: 3CON-R31) and its full-sized humanoid robot Agibot A3; UBTECH (Booth: 3CON-R27), one of the "Shenzhen Eight Great Guardians", which is exhibiting its next-generation full-sized humanoid robot Walker C1, developed for urban coexistence; and DEEP Robotics (Booth: 3CON-R19), one of the "Hangzhou Six Little Dragons", displaying its quadruped robots Lite3 and M20. Other renowned exhibitors include the Shenzhen Honor Smart Technology Development Co., Ltd. (Booth: 3CON-R37), whose humanoid robot was the winner of the 2026 Beijing E-Town Half Marathon, and Booster Robotics (Booth: GH-R13), champion of the 2026 RoboCup. A number of well-known technology companies from the "Shenzhen Eight Great Guardians" and "Hangzhou Six Little Dragons" are also showcasing their latest innovations, including AI² Robotics (Booth: GH-Q01), Digit (Booth: 3CON-R49), EngineAI (Booth: 3CON-R52) and first-time exhibitor DexForce (Booth: GH-R07). The fair features several leading technology companies, including Booster Robotics (Booth: GH-R13), champion of the 2026 RoboCup, which showcases its latest innovations and technological achievements RoboPark features multiple demonstration and experience zones, enabling buyers to explore how robotics technologies are being integrated into industries and everyday life. They include the RoboDog Garden, showcasing robotic dogs; the Robot Dance Battle, featuring dance performances by robots; and the Coffee & Popcorn Station, where robots prepare snacks and drinks, allowing visitors to experience the practical application potential of robotics at first hand. RoboPark features multiple interactive experience and demonstration zones. At the "Coffee & Popcorn Station", robots prepare snacks and drinks for visitors New products highlight AI integration across healthcare, lifestyle and entertainment Smart Wellness encompasses digital health devices, smart wearables, personal care technologies, gerontech and healthy living electronics, reflecting strong market demand for technology-enabled health management and improved quality of life. Smart Wellness is another key focus of the Autumn Electronics Fair, with exhibitors showcasing innovative solutions ranging from digital health devices and smart wearables to personal care technologies, gerontech and healthy living electronics. Many exhibitors are leveraging the fair as a platform to showcase newly introduced products. Future Access Technology Co., Limited (Booth: 1C-D06) is presenting the LYRA, a screen-free smart wristband designed to minimise distractions and help users focus on daily life activities while supporting personalised fitness programmes and more than 170 sports modes. Cheung Shing Development (H.K.) Limited (Booth: 3D-E06) is displaying its latest Hearing Aid Glasses for people with mild to moderate hearing loss. Equipped with sound amplification technology, the glasses improve speech clarity in noisy environments and enhance communication experiences. NEXTEntertainment features extended reality (XR) technologies, smart gaming devices, digital content creation tools, AI-powered entertainment solutions and innovative consumer electronics designed to enhance both entertainment experiences and digital content creation. Among the highlights, DreamGear LLC (Booth: 1D-C09) is showcasing a new rechargeable retro gaming console featuring more than 200 built-in classic games, smart backlit button prompts and multiple control modes, combining nostalgic arcade gaming with modern innovation. The Autumn Electronics Fair features more than 20 exhibition zones. The Hall of Fame brings together over 560 renowned brands, including first-time exhibitors Aoni (Booth: 1A-D02) and HEAD (Booth: 1C-A12). RISE Avenue highlights emerging brands including Beijing Huahon Data Technology Co., Ltd. (Booth: 1CON-003), which is making its global debut with the All-in-One Liquid-Cooled AI Computing System, providing powerful computing capabilities for large-model training, AI inference and visual rendering through advanced liquid-cooling technology. The Adventure Hub features the Immersive Experience Zone, showcasing the latest applications of XR technologies, brain-computer interfaces and other creative technologies. Highlights include a brainwave-controlled claw machine from Yugu Technology (Booth: 5E-D12). Meanwhile, the Tech Hall focuses on AI, professional data and Internet of Things (IoT) solutions. Among the exhibitors, Guangzhou Quwan Network Technology Co., Ltd (Booth: CH-H10) is presenting the TemPolor Melo-D Generative AI Guitar, which integrates AI into music creation. Users simply upload their favourite songs and the system generates fingerstyle melodies while providing illuminated guidance on the guitar body and display screen to assist performance. More than 120 start-ups connecting with opportunities The fairs also bring together more than 120 promising young enterprises and start-ups, primarily in the Startup Zone. The IOT HK Association Limited and JimHang Academy are each leading groups of start-ups showcasing technologies and solutions designed to address real-world business challenges. A range of supporting activities will also be held, including investment matching sessions, the Hong Kong Value Creation for Technology: Pitching Competition and mentorship programmes, helping start-ups refine their business models, expand investor networks and strengthen their market competitiveness. The fair brings together more than 120 promising young enterprises and start-ups, primarily showcased within the Startup Zone electronicAsia connects the electronics supply chain Held concurrently with the Autumn Electronics Fair, electronicAsia (eAsia) features multiple thematic zones covering electronic components, display technologies, printed circuit boards and electronic manufacturing services, as well as testing and measurement instruments. Together, the two fairs create a comprehensive one-stop sourcing platform spanning the entire electronics industry supply chain. eAsia features a wide range of electronic components, display technologies, printed circuit boards, electronics manufacturing services and testing instruments, forming a one-stop sourcing platform together with the Autumn Electronics Fair Among the exhibitors at eAsia, Rapid Conn (S) Pte. Ltd. (Booth: 5B-C10) is showcasing advanced interconnect solutions, while Surface Mount Technology Ltd. (Booth: 5B-D01) is presenting cutting- edge AI and AIoT solutions. The fairs also feature a rich programme of forums and seminars. The 11th Symposium on Innovation & Technology, jointly organised by HKTDC and the Hong Kong Electronics and Technologies Association, takes place today under the theme "AI-Driven Security & The Next-Gen Infrastructure". Speakers include Alexander Gerfer, Chief Technology Officer of Würth Elektronik Group; Dr Charles Cheung, Adjunct Associate Professor in the Department of Mathematics at Hong Kong Baptist University; and Silvia Ihensekhien, Chief Security Advisor, Greater China at Microsoft. The Symposium on Innovation & Technology, jointly organised by HKTDC and the Hong Kong Electronics and Technologies Association, takes place today under the theme "AI-Driven Security & The Next-Gen Infrastructure" In addition, the Hong Kong Electronic Forum, jointly organised by the HKTDC, MMI Asia Pte Ltd and the Hong Kong Electronic Industries Association, with support from the Electronics Division of The Hong Kong Institution of Engineers, will be held on 15 October under the theme "Future Tech: Powering Electronics Competitiveness with AI and Sustainable Innovation", exploring how AI, sustainability and technological innovation are reshaping the future of the electronics sector. Under the EXHIBITION+ hybrid model, exhibitors and buyers can meet online through the HKTDC Click2Match smart business matching platform in addition to attending the physical fairs. The online exhibitions for the Hong Kong Electronics Fair (Autumn Edition) and electronicAsia run from 6 to 23 October. Photo download: https://bit.ly/4AVhNOu Websites - Hong Kong Electronics Fair (Autumn Edition): https://www.hktdc.com/event/hkelectronicsfairae/en - electronicAsia: https://www.hktdc.com/event/electronicasia/en Media enquiries Please contact the HKTDC’s Communications & Public Affairs Department: Katy Wong Tel: (852) 2584 4524 Email: [email protected] Clayton Lauw Tel: (852) 2584 4472 Email: [email protected] HKTDC Media Room: https://mediaroom.hktdc.com/en About HKTDC The Hong Kong Trade Development Council (HKTDC) celebrates its 60th anniversary this year. The HKTDC is a statutory body established in 1966 to promote, assist and develop Hong Kong's trade. With over 50 offices globally, including 13 in the Chinese Mainland, the HKTDC promotes Hong Kong as a two-way global investment and business hub. The HKTDC organises international exhibitions, conferences and business missions to create business opportunities for companies, particularly small and medium-sized enterprises (SMEs), in the mainland and international markets. The HKTDC also provides up-to-date market insights and product information via trade publications, research reports and digital news channels. For more information, please visit: www.hktdc.com/aboutus.
  10. AIMovable InkMovable Ink Introduces Headless Marketing CapabilitiesAgentic Orchestration Includes Launch of AI-Powered Assistants — Movable Ink, the AI-powered personalized content platform, today announced new headless marketing capabilities, enabling marketers to create, manage, and optimize campaigns directly within...
  11. SaaSFaraday Powers Intelligent Sensing with New 14nm MIPI C/D Combo PHY IPSilicon-proven 14nm MIPI C/D Combo PHY delivers high-speed, power-efficient connectivity with >30% IP area reduction, simplifying integration & MP testing
  12. SaaSSinch expands SAP partnership with RCS integration for SAP Engagement CloudCompanies: SAPSinch AB (publ) announces that Rich Communication Services (RCS) is now available as part of its native integration with SAP Engagement Cloud, expanding Sinch's existing SAP partnership with a new messaging channel. The integration also creates new...