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- 音频格隆汇9.30盘前要点—港A美股你需要关注的大事都在这格隆汇9月30日｜国际要闻：1、美债收益率依旧走高美股三大指数小幅收跌2、美联储10月加息的概率降至49.8%3、外交信号与供给回升共同压制原油重挫逾3%4、OPEC+或将坚持石油产量配额的计划5、日本2年期国债收益率正逼近2%重要关口6、特朗普签署“具有道德约束力”的人工智能文件还改名AI为SI7、AT&T与康宁签署超30亿美元的多年期协议8、特斯拉签署300亿美元融资安排包括循环信贷和延迟提款...
- Verizon Communications, Inc.Verizon Elects Charles Phillips to its Board of DirectorsCompanies: VerizonVerizon Communications Inc. (NYSE, Nasdaq: VZ) today announced the election of Charles Phillips, Co-Founder & Managing Partner of Recognize Partners LP (“Recognize”), to the Verizon Board of Directors, effective immediately.
- Go!FotonGo!Foton Introduces New Fiber Connectivity and Demos Optical Sensing Enhancements at SCTE TechExpo '26Booth D706 Showcases Next-Gen Physical Layer Connectivity and Management — Go!Foton, a global leader in fiber optic connectivity solutions, will showcase its latest fiber connectivity innovations designed to help network operators simplify...
- Zyxel Partners with Streakwave to Expand Access to Outdoor Wireless SolutionsNew distribution partnership brings Zyxel’s Point-to-Multipoint and Point-to-Point outdoor wireless solutions to WISPs and broadband providers
- 肉签来了，两大龙头股今日上市专题：A股又遇“假期综合征”，回调正是布局良机 9月29日，有两只新股上市，分别为创业板新股 鸿富诚 （301716.SZ）与北交所新股 安达股份 （920202.BJ）。 鸿富诚是一家专注热管理、电磁屏蔽和吸波等先进电子功能材料及器件研发、产业化的国家级专精特新重点“小巨人”企业，产品主要包括导热界面材料、电磁屏蔽及吸波材料。该等材料是保障各类电子信息产品可靠性和稳定运行的关键材料，广泛应用于数据中心（AI高功率芯片、光模块）、智能汽车、5G通信及消费电子等领域。 若按鸿富诚发行价76.86元/股、年内新股上市首日平均262.68%的涨幅测算，中一签（500股）浮盈或达10.09万元。 在热管理领域，鸿富诚是行业内极少数能够量产制备石墨烯导热垫片并实现规模应用的企业，并直接和国际材料头部企业展开竞争。公司采用创新取向技术，实现石墨烯材料的垂直排列，充分挖掘石墨烯在垂直方向的优异导热性能，通过界面功能化实现极低热阻。目前，公司量
- MetaMeta Partners With Government Agencies, Law Enforcement, and Safety Organizations to Launch Regional Anti-Scam Education CampaignCompanies: Meta PlatformsAs scams grow more sophisticated and difficult to detect, keeping people safe takes more than technology alone – it also requires education. Today, we’re sharing progress on our “One Step Ahead” anti-scam education campaign designed to help people across Asia-Pacific take simple, practical steps to protect their accounts and know where to turn for help when they encounter a potential scam. The campaign was designed alongside more than 25 local safety organizations, law enforcement and government agencies across the region, and rolled out across Facebook and Instagram with three simple principles at its core: 1) safety advice should be practical, 2) easy to act on, and 3) come from a source people trust. Since launching in May 2026, the campaign has reached more than 303 million people across 18 countries, delivering over 1.3 billion impressions and more than 1.2 million link clicks — one of the largest online-safety education efforts Meta has run in the region. The campaign promotes security tools available on Meta apps that people can use to increase their online safety: Two-factor authentication adds a second check at login, so a stolen password isn’t enough to get in. Passkeys let people sign in with the fingerprint, face or PIN they already use – passkeys can’t be stolen, shared, guessed or reused. Security Checkup walks people through strengthening their Facebook account in minutes. Privacy Checkup keeps people in control of who can see, message and connect with them. WhatsApp’s Linked Device Warning alerts users when it detects a suspicious login attempt, an unauthorized web client, or a potential account-linking scam. WhatsApp group settings allow you to adjust group privacy settings to choose who can add you to WhatsApp groups. Partnering with the people communities already trust Collaboration is key in tackling scams and educating people on how to be safe online. Working with respected local partners lets us extend our reach, reinforce credibility, and make sure people know how to access local anti-scam resources. Through the campaign’s “Know Your Local Resources” element – which alone reached more than 27.4 million people across 14 markets – people are connected directly to trusted organizations in their own country for reporting tools and support. See below for a full list of partner organizations. What’s next The “One Step Ahead” campaign will continue throughout 2026, with new tools and locally tailored resources rolling out across the region and more partnerships on the way. We’re committed to supporting people beyond a single campaign: scammers keep evolving, and staying one step ahead is work that’s never truly finished. People can explore how to protect their accounts at Meta’s Scam Protection Center. Partnering organizations include: Australia: Scamwatch (operated by the Australian Competition and Consumer Commission) Bangladesh: Bangladesh Telecommunication Regulatory Commission (BTRC) Hong Kong: Anti-Deception Coordination Centre (ADCC); Cyber Defender India: National Cyber Crime Reporting Portal (cybercrime.gov.in) Indonesia: Ministry of Communication and Digital Affairs (Komdigi / Kementerian Komunikasi dan Digital); Cyber Crime Directorate of the Criminal Investigation Agency of the Indonesian National Police (Direktorat Siber Bareskrim Polri); Indonesia Anti-Scam Centre (IASC); Ministry of Trade (Kementerian Perdagangan) Japan: National Police Agency Kazakhstan: Ministry of Culture and Information; The Department for Countering Cybercrime of the Ministry of Internal Affairs New Zealand: Netsafe Pakistan: Pakistan Telecommunication Authority (PTA) Philippines: Bangko Sentral ng Pilipinas (Central Bank of the Philippines, BSP); Securities and Exchange Commission (SEC); Cybercrime Investigation and Coordinating Center (CICC); Whoscall; Bayan Academy Singapore: Singapore Police Force (SPF); National Crime Prevention Council (NCPC) Taiwan: MyGoPen; The Criminal Investigation Bureau; ADI Thailand: NEC; Ministry of Digital Economy and Society (MDES); Electronic Transactions Development Agency (ETDA) Uzbekistan: The Ministry of Digital Technologies of Uzbekistan; National Agency of Perspective Projects (NAPP) The post Meta Partners With Government Agencies, Law Enforcement, and Safety Organizations to Launch Regional Anti-Scam Education Campaign appeared first on Meta Newsroom.
- South Korea Semiconductor Foundry Market Size and Share - Growth Analysis and Forecast 2026-2035 | AI and 2 nm GAA Demand Drive a US$42.30 Billion OpportunityAI/HPC demand, advanced GAA nodes, public investment, automotive and 5G orders, and Gyeonggi’s fab ecosystem strengthen South Korea’s foundry market
- Global Wafer Level Packaging Market Size, Share, Trends, Competitive Landscape and Forecast, 2026 to 2034 | 11.2% CAGR Fueled by AI, 5G, Automotive, and Fan-Out PackagingFan-out packaging, advanced RDL and strategic partnerships enable higher I/O density, lower costs and scalable growth across AI, 5G, automotive and consumer electronics
- MENA Semiconductor Memory Market Size, Trends, and Forecast to 2032 | Automotive, Telecom, and Industrial Demand Create Growth OpportunitiesIdentify high-potential segments, entry routes and competitive positioning through insights on demand, trends, growth drivers and distributor networks across MENA
- Poland Semiconductor Memory Market Size, Trends, and Forecast to 2032 | Automotive, Industrial, and Telecom Demand Creates Strategic Growth OpportunitiesUnlock Poland’s semiconductor memory market with insights into demand, key trends, growth drivers, competitive positioning, distributors and market-entry opportunities.
- Kinwong Electronic Debuts on Hong Kong Stock Exchange: Emerging AI Computing Business, Mature Segments Fund ExpansionHONG KONG, Sept 29, 2026 - As global AI model infrastructure investment enters a boom phase, and with continued penetration of edge AI and vehicle electrification and smart features, the printed circuit board (PCB) industry is benefiting from both technology upgrading and value chain re-rating. Riding this industry tailwind, Shenzhen Kinwong Electronic Co., Ltd. (“Kinwong” or the “Company”, 3228.HK), a leading global PCB manufacturer, officially listed on the Hong Kong Stock Exchange on September 29, 2026, completing its “A+H” dual listing platform. The prospectus lays out a clear “1+1+N” business structure: telecommunications and data infrastructure (including AI compute) as the new growth driver, complemented by high-potential segments including smart devices and industrial control, with industry-leading automotive electronics as the stable base, forging a path of sustainable, high-quality growth. Seizing the AI Compute Boom: AI Core Business Begins to Deliver As one of the few manufacturers supplying PCB to global leading AI computing infrastructure companies, Kinwong is leveraging its first-mover advantage to translate infrastructure tailwinds into strong financial results. According to the prospectus, in the first four months of 2026, revenue from AI-related PCBs reached RMB268 million — a four-month value already about 35.1% above the full-year 2025 total, lifting its share of total revenue to 5.0%. Driven by AI compute demand, revenue from the telecommunications and data infrastructure segment surged from RMB772 million in 2023 to RMB1.591 billion in 2025, doubling in two years. In the first four months of 2026, this segment accounted for 15.6% of total revenue, becoming the key engine of overall growth. Years of investment in high-end process technology are now paying off. As early as 2019, Kinwong proactively built production bases for high-layer-count (HLC) PCBs and high-end HDI PCBs. Today, the Company has achieved mass production of AI compute-related products, including HLC PCBs with over 40 layers, 6-build-up 22-layer HDI PCBs, 14-layer HDI PCBs using the mSAP process, and multilayer PTFE flexible PCBs. The Company has established manufacturing capability for HLC PCBs above 70 layers and 9-build-up 28-layer HDI PCBs. In addition, customer certification has commenced for 11-build-up HDI PCBs. Notably, the 9-build-up 28-layer HDI PCB completed customer qualification in only 90 days, demonstrating both product reliability and fast ramp-up speed. Expanding into Edge AI: Full-Spectrum Hardware Plays Beyond cloud computing and its established automotive business, Kinwong is capitalizing on the edge AI trend, extending the “N” in its “1+1+N” strategy to mid- and high-end hardware across humanoid robots, drones and industrial automation, positioning early to capture the device upgrade cycle. The Company has a strong consumer electronics customer base, serving seven of the world’s top ten smartphone brands. As edge AI drives higher hardware specifications, demand for value-added products such as HDI and rigid-flex PCBs is rising, opening up sustainable growth avenues. Driven by synergies across all segments, Kinwong’s overall performance has grown steadily. Per the prospectus, revenue reached RMB10.757 billion, RMB12.659 billion and RMB15.308 billion in 2023, 2024 and 2025, while profit for the year came in at RMB911 million, RMB1.160 billion and RMB1.244 billion respectively — three consecutive years of steady growth on both top and bottom lines. In the first four months of 2026, revenue hit RMB5.341 billion, showing continued scale expansion and strong through-cycle resilience. Automotive Electronics Anchors the Stable Cash Base: Funding AI Compute Expansion Developing and scaling high-end AI compute PCBs requires substantial and sustained capital expenditure and R&D spending. Kinwong’s solid position in global automotive electronics PCB gives it resilience and steady cash flow, providing a stable financial base for expanding into the high-barrier AI compute market. According to CIC, based on 2025 revenue, Kinwong was the world’s largest automotive electronics PCB supplier with 10.6% market share, and ranked 11th among overall PCB manufacturers globally with 2.5% share. Eight of the world’s top ten Tier 1 automotive suppliers are core Kinwong customers, and its PCBs are used across products from all top ten global automakers, reflecting strong customer moats and high business visibility. The Company’s operations provide a stable cash-generative base that, together with the IPO proceeds and debt financing, supports high-end capacity build-out, including the Zhuhai Jinwan base, creating a reinforcing cycle: mature businesses generate cash, emerging businesses drive growth.
- Kinwong Electronic Debuts on Hong Kong Stock Exchange: Emerging AI Computing Business, Mature Segments Fund ExpansionHONG KONG, Sept 29, 2026 - As global AI model infrastructure investment enters a boom phase, and with continued penetration of edge AI and vehicle electrification and smart features, the printed circuit board (PCB) industry is benefiting from both technology upgrading and value chain re-rating. Riding this industry tailwind, Shenzhen Kinwong Electronic Co., Ltd. (“Kinwong” or the “Company”, 3228.HK), a leading global PCB manufacturer, officially listed on the Hong Kong Stock Exchange on September 29, 2026, completing its “A+H” dual listing platform. The prospectus lays out a clear “1+1+N” business structure: telecommunications and data infrastructure (including AI compute) as the new growth driver, complemented by high-potential segments including smart devices and industrial control, with industry-leading automotive electronics as the stable base, forging a path of sustainable, high-quality growth. Seizing the AI Compute Boom: AI Core Business Begins to Deliver As one of the few manufacturers supplying PCB to global leading AI computing infrastructure companies, Kinwong is leveraging its first-mover advantage to translate infrastructure tailwinds into strong financial results. According to the prospectus, in the first four months of 2026, revenue from AI-related PCBs reached RMB268 million — a four-month value already about 35.1% above the full-year 2025 total, lifting its share of total revenue to 5.0%. Driven by AI compute demand, revenue from the telecommunications and data infrastructure segment surged from RMB772 million in 2023 to RMB1.591 billion in 2025, doubling in two years. In the first four months of 2026, this segment accounted for 15.6% of total revenue, becoming the key engine of overall growth. Years of investment in high-end process technology are now paying off. As early as 2019, Kinwong proactively built production bases for high-layer-count (HLC) PCBs and high-end HDI PCBs. Today, the Company has achieved mass production of AI compute-related products, including HLC PCBs with over 40 layers, 6-build-up 22-layer HDI PCBs, 14-layer HDI PCBs using the mSAP process, and multilayer PTFE flexible PCBs. The Company has established manufacturing capability for HLC PCBs above 70 layers and 9-build-up 28-layer HDI PCBs. In addition, customer certification has commenced for 11-build-up HDI PCBs. Notably, the 9-build-up 28-layer HDI PCB completed customer qualification in only 90 days, demonstrating both product reliability and fast ramp-up speed. Expanding into Edge AI: Full-Spectrum Hardware Plays Beyond cloud computing and its established automotive business, Kinwong is capitalizing on the edge AI trend, extending the “N” in its “1+1+N” strategy to mid- and high-end hardware across humanoid robots, drones and industrial automation, positioning early to capture the device upgrade cycle. The Company has a strong consumer electronics customer base, serving seven of the world’s top ten smartphone brands. As edge AI drives higher hardware specifications, demand for value-added products such as HDI and rigid-flex PCBs is rising, opening up sustainable growth avenues. Driven by synergies across all segments, Kinwong’s overall performance has grown steadily. Per the prospectus, revenue reached RMB10.757 billion, RMB12.659 billion and RMB15.308 billion in 2023, 2024 and 2025, while profit for the year came in at RMB911 million, RMB1.160 billion and RMB1.244 billion respectively — three consecutive years of steady growth on both top and bottom lines. In the first four months of 2026, revenue hit RMB5.341 billion, showing continued scale expansion and strong through-cycle resilience. Automotive Electronics Anchors the Stable Cash Base: Funding AI Compute Expansion Developing and scaling high-end AI compute PCBs requires substantial and sustained capital expenditure and R&D spending. Kinwong’s solid position in global automotive electronics PCB gives it resilience and steady cash flow, providing a stable financial base for expanding into the high-barrier AI compute market. According to CIC, based on 2025 revenue, Kinwong was the world’s largest automotive electronics PCB supplier with 10.6% market share, and ranked 11th among overall PCB manufacturers globally with 2.5% share. Eight of the world’s top ten Tier 1 automotive suppliers are core Kinwong customers, and its PCBs are used across products from all top ten global automakers, reflecting strong customer moats and high business visibility. The Company’s operations provide a stable cash-generative base that, together with the IPO proceeds and debt financing, supports high-end capacity build-out, including the Zhuhai Jinwan base, creating a reinforcing cycle: mature businesses generate cash, emerging businesses drive growth.