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- MicrosoftSimulating student learning for better AI tutoringCompanies: MicrosoftThe post Simulating student learning for better AI tutoring appeared first on Source.
- MicrosoftMicrosoft to expand Maia chip for the AI eraCompanies: MicrosoftThe post Microsoft to expand Maia chip for the AI era appeared first on Source.
- Akamai Technologies, Inc.Akamai Recognized as a Leader in the IDC MarketScape: Worldwide Web Application and API Protection (WAAP) Platforms 2026 Vendor AssessmentCompanies: Akamai TechnologiesIDC MarketScape highlights Akamai’s broad telemetry base, purpose-built runtime protection for AI adopters, and layered AI security strategy as strengths
- DeepSight Technology, Inc.DeepSight Technology Appoints Scott Huennekens to Board of DirectorsFormer Volcano and Verb Surgical CEO brings extensive experience in interventional imaging, surgical robotics, and medical technology commercialization as DeepSight advances its Physical AI platform — DeepSight Technology, Inc., a company...
- NVIDIAOCP Global Summit: Amid Ecosystem Adoption, NVIDIA Opens Vera Rubin Architecture to Help Scale AI Factories WorldwideCompanies: NvidiaAs AI factories grow from megawatts to gigawatts, building them takes more than advanced computing. Open standards are helping the industry scale AI infrastructure faster, more efficiently and more reliably. At the Open Compute Project (OCP) Global Summit, taking place in the San Jose McEnery Convention Center, NVIDIA announced new partnerships and contributions aimed at […]
- Cisco Advances Scalability and Openness at OCP 2026Companies: CiscoDelivers the resilient, open Ethernet foundations required to connect and scale massive, distributed AI factories News Summary Cisco and NVIDIA plan to develop an open industry specification for a next-generation 400G-per-lane pluggable optics design, increasing bandwidth density while...
- NVIDIANVIDIA and Cisco Introduce New Pluggable Optics Form Factor to Scale AI FactoriesCompanies: NvidiaCiscoNVIDIA and Cisco today announced plans for Ultra-Dense Small Form Factor Pluggable (USFP), a new high-density 400Gb/s-per-lane optical module designed to equip the hardware ecosystem for the next generation of AI factories using pluggable transceivers.
- Micas NetworksMicas Networks Unveils Three 102.4T Open Ethernet Platforms for AI Factories at OCP Global Summit 2026Micas’ Tomahawk 6-based portfolio spans 800G air-cooled, 1.6T liquid-cooled, and 1.6T Davisson CPO systems for next-generation AI factories
- NVIDIA and Cisco Introduce New Pluggable Optics Form Factor to Scale AI FactoriesCompanies: NvidiaCiscoNew Transceivers Enable AI Builders to Scale Compute Within the Same Network Footprint While Reducing Networking’s Share of the Power Budget
- GMV field tests a new ESA software in Fuerteventura: a giant leap for rover speedThe technology multinational GMV completed a test campaign in Lajares, a village in the municipality of La Oliva, Fuerteventura, for an on-board autonomy framework comprising a matured Guidance, Navigation and Control (GNC) system, FASTNAV, and a new, AI-enabled perception subsystem, called HAWKEYE, which uses on-board inference to detect hazardous obstacles and terrains. - - Over eleven days, the company deployed and validated the GNC system as part of NOMAD, a modular autonomous navig... Read the full story at https://www.webwire.com/ViewPressRel.asp?aId=362734
- TomTom and DeepRoute.ai partner to advance AI-based automated driving- - • The two companies have signed a memorandum of understanding covering their joint technical work on AI-based automated driving - • An integrated demonstration vehicle will be showcased during the Paris Motor Show - - - TomTom ( TOM2 ), the specialist in mapping and location technology, and DeepRoute.ai, the AI-powered automated driving technology company, signed a memorandum of understanding covering their joint technical work on automated driving. The two companies have integrate... Read the full story at https://www.webwire.com/ViewPressRel.asp?aId=362731
- ChervonChervon 任命蘭德爾·杜爾坎為北美供應鏈副總裁伊利諾伊州納珀維爾, 2026年10月12日 - 蘭迪·杜爾坎(Randy Durkan)加入 Chervon,擔任北美供應鏈副總裁,自2026年10月12日(星期一)起生效,直接向執行長喬·加利(Joe Galli)彙報。 蘭迪·杜爾坎擁有超過 25 年的供應鏈管理經驗,包括在電動工具、手動工具及戶外動力設備領域的豐富領導經驗。他在建立高績效供應鏈團隊方面擁有經實證的經驗,並持續在服務水準、庫存優化及成本削減方面取得卓越成果。杜爾坎以與關鍵客戶建立堅實的供應鏈合作夥伴關係、推動跨職能協作,以及運用科技實現世界級供應鏈績效而聞名。 他的供應鏈職涯始於阿肯色州本頓維爾,當時負責協調多家消費品公司與沃爾瑪的合作事務。他在 Vi-Jon 公司的表現,為沃爾瑪贏得 2008 年度「年度供應商獎」立下功勞。 隨後,杜爾坎在日立諮詢(Hitachi Consulting)從事供應鏈管理諮詢工作長達六年,足跡遍及全球,協助客戶提升供應鏈績效。2019年,蘭迪加入TTI擔任消費品與戶外動力設備事業部供應鏈資深副總裁,期間再度帶領團隊達成「年度最佳供應商」級別的卓越表現。 最近,杜爾坎曾擔任Apex Tool Group銷售、庫存與營運規劃(SIOP)副總裁。 杜爾坎(Durkan)擁有賓州州立大學(Penn State University)商業物流與國際商務學士學位。他亦是 TTI 突破性領導力計畫的畢業生,並持有 APICS 頒發的生產與庫存管理認證。 「我們非常幸運能迎來蘭迪(Randy)加入 Chervon,擔任北美供應鏈副總裁,」執行長喬·加利(Joe Galli)表示。「他世界級的供應鏈管理技能、具變革性的 AI 整合能力,以及對客戶的極致關注,將協助我們將公司推向新的高度。」 「Chervon 對客戶服務與成長的重視,與我的經驗和技能完美契合,」杜爾肯表示。「我期待透過卓越的供應鏈管理、高績效的團隊合作以及 AI 整合,協助 Chervon 超越客戶的期望。」 關於 CHERVON Chervon 北美公司隸屬於一家全球性全方位解決方案供應商,專精於電動工具及戶外動力設備(OPE)的研發、製造、測試、銷售及售後服務。本公司秉持以用戶為中心的創新理念,透過全球銷售與分銷網絡,營運整合式商業模式。Chervon 的產品組合涵蓋 EGO、FLEX、SKIL 及 DEVON 等品牌,服務全球工業、專業及消費市場。 更好的工具。更好的世界。 Chervon 致力於透過持續創新,為全球用戶提供卓越的產品,並力求在鋰離子、智慧與數位時代,成為電動工具及戶外動力設備(OPE)領域的全球領導者。 公關聯絡人: 企業傳播部: [email protected] 消息來源:Chervon