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- Digi Power X Inc.Digi Power X 宣布獲得 2 億美元債務融資承諾,以支持阿拉巴馬州 AI 資料中心竣工,並公布擴張進度佛羅里達州邁阿密海灘, 2026年10月13日 - Digi Power X Inc. (納斯達克代碼:DGXX) (Cboe Canada:DGX)(「Digi Power X」或「本公司」),一家人工智慧資料中心基礎設施營運商,今日宣布已收到一家主要貸款機構的承諾函,將提供 2 億美元債務融資,以支持其在阿拉巴馬州科倫比亞納市(Columbiana)開發 40 兆瓦人工智慧資料中心。此項由高盛(Goldman Sachs)牽頭的銀團融資,預計將於90天內完成,惟須待最終文件簽署及各項條件達成,包括貸款方完成盡職調查。 此次融資將以專案特殊目的實體(「SPV」)為架構進行,並由本公司提供無擔保擔保,擔保範圍涵蓋專案完工期間及其他有限事項。募集資金擬用於支持阿拉巴馬州專案的完工及相關專案成本,藉此協助維持公司流動性、減輕股東稀釋影響,並使本公司能爭取更多客戶合約。 「這項融資承諾是我們在完成阿拉巴馬州校區建設的
- Digi Power X Inc.Digi Power X 宣布獲得 2 億美元債務融資承諾,以支持阿拉巴馬州 AI 資料中心竣工,並公布擴張進度佛羅里達州邁阿密海灘, 2026年10月13日 - Digi Power X Inc. (納斯達克代碼:DGXX) (Cboe Canada:DGX)(「Digi Power X」或「本公司」),一家人工智慧資料中心基礎設施營運商,今日宣布已收到一家主要貸款機構的承諾函,將提供 2 億美元債務融資,以支持其在阿拉巴馬州科倫比亞納市(Columbiana)開發 40 兆瓦人工智慧資料中心。此項由高盛(Goldman Sachs)牽頭的銀團融資,預計將於90天內完成,惟須待最終文件簽署及各項條件達成,包括貸款方完成盡職調查。 此次融資將以專案特殊目的實體(「SPV」)為架構進行,並由本公司提供無擔保擔保,擔保範圍涵蓋專案完工期間及其他有限事項。募集資金擬用於支持阿拉巴馬州專案的完工及相關專案成本,藉此協助維持公司流動性、減輕股東稀釋影響,並使本公司能爭取更多客戶合約。 「這項融資承諾是我們在完成阿拉巴馬州校區建設的同時,將股東權益稀釋程度降至最低的重要一步。我們正從基礎設施建設邁向營收創造階段:阿拉巴馬州的施工進度如期推進,首個模組化 GPU 部署已順利運作,且我們整個投資組合的擴張計畫也正穩步推進。」 ——米歇爾·阿馬爾(Michel Amar),Digi Power X Inc. 董事長兼執行長 財務狀況與阿拉巴馬州建設進度更新 截至本公告日期,Digi Power X 持有約 1.35 億美元現金,並於 2026 年年初至今投入約 1.53 億美元用於資本支出。本公司於 2026 年第三季未依據其「按市價發行」(「ATM」)股權發行計畫發行任何股份,因此該季未發生與 ATM 相關的股東稀釋。 位於阿拉巴馬州、總容量 40 MW 的園區建設進度仍符合預期,第一期預計於 2026 年 12 月完工,第二期則預計於 2027 年 3 月完工。 ARMS 200 營運與 Supermicro 合作夥伴關係 本公司首座 ARMS 200 模組化資料中心自 2026 年 5 月起運作順利,支援其 GPU 裸機業務。此次部署展現了 Digi Power X 管理支援這些服務之基礎設施的能力,包括供電、散熱、資料中心營運及 GPU 系統。 Digi Power X 與 Super Micro Computer, Inc.(「Supermicro」)的合作夥伴關係,支援對 NVIDIA Blackwell GPU 的專用裸機存取,讓客戶無需自行建置或管理底層基礎設施,即可部署 AI 工作負載。Supermicro 近期公開強調了這項合作,並著重闡明其於推動 Digi Power X 全堆疊 AI 解決方案中所扮演的角色。 Digi Power X:透過 NeoCloudz 擴展 AI 代幣工廠 Digi Power X 計劃透過其 NeoCloudz 平台擴展 AI 代幣工廠基礎設施,並採用 US Data Center, Inc.(本公司為其最大股東)的專有 ARMS 模組化資料中心系統,以支援快速部署。此擴展旨在支援本公司在 GPU 裸機服務及 AI 代幣生成領域的成長計畫。在初期 ARMS 200 部署的基礎上,本公司擬部署額外的模組化容量,以滿足客戶需求並提升 AI 基礎設施的經常性營收。 「我們很興奮能在 NVIDIA GTC 柏林大會上揭曉我們的 AI 代幣工廠。Digi Power X 掌握從電源、資料中心到電腦的完整技術堆疊,正因如此,我們才能在大規模環境下提供快速且經濟實惠的推論服務。」 —— Alec Amar,Digi Power X Inc. 總裁 紐約轉型為 AI 代幣工廠 Digi Power X 目前正處於規劃階段,擬將其位於紐約州的場址轉型為 AI 代幣工廠,以擴充 GPU 裸機服務及 AI 代幣生成能力。此次規劃中的轉型旨在降低場址噪音水平,並導入閉環冷卻系統——該系統透過冷卻液循環利用,無需例行蒸發用水,從而將用水量降至最低。 矽谷研發實驗室 該公司亦已收購矽谷的一處辦公及實驗室設施,用以開發支援其 AI 代幣工廠策略的技術與營運智慧。隨著 Digi Power X 擴展其 GPU 基礎設施與 AI 服務,正匯聚工程、人工智慧及軟體開發領域的頂尖人才,以加速創新並強化其能力。 關於 Digi Power X Digi Power X 是一家完全整合的 AI 基礎設施公司,擁有並營運從發電、資料中心到執行 AI 工作負載的電腦等整個技術堆疊。本公司為企業及超大規模客戶提供機房託管服務、裸機 GPU 租賃,以及能大規模提供 AI 推論服務的「代幣工廠」。由於 Digi Power X 同時掌控電力、基礎設施及運算資源,因此能夠以更快的速度和更實惠的成本將運算容量投入運作。如需更多資訊,請造訪 https://www.digipowerx.com/。 投資者關係 如需進一步資訊,請聯絡: Michel Amar,執行長 Digi Power X Inc. https://www.digipowerx.com/ 投資者關係:電話:888-474-9222 | 電子郵件:[email protected] 警示聲明 本公司證券交易應被視為高度投機性行為。任何證券交易所、證券委員會或其他監管機構均未對本文所含資訊予以批准或否決。Cboe Canada 對本新聞稿的充分性或準確性不承擔任何責任。 警示聲明與前瞻性陳述 本新聞稿包含《1995年私人證券訴訟改革法案》安全港條款所定義的「前瞻性陳述」,以及適用之加拿大證券法所定義的「前瞻性資訊」(統稱「前瞻性陳述」)。除歷史事實陳述外,所有陳述均屬前瞻性陳述。諸如「預期」、 「相信」、「持續」、「估計」、「預期」、「打算」、「可能」、「計劃」、「潛在」、「擬議」、「應」、「目標」、「將」、「會」等詞彙及類似表述,旨在標示前瞻性陳述,儘管並非所有前瞻性陳述均包含這些詞彙。 本新聞稿中的前瞻性陳述包括但不限於以下內容:關於擬議的 2 億美元債務融資之陳述,包括交割與撥款的時間點,以及滿足交割條件(包括貸款方完成盡職調查要求);預期募集資金用途,包括用於支付剩餘建設及相關專案成本,以及對公司流動性與股東稀釋之預期影響; 本公司位於阿拉巴馬州科倫比亞納的 40 百萬瓦 AI 資料中心第一期與第二期的進度、時程及完工狀況,以及本公司爭取更多客戶合約並產生經常性收入的能力;本公司 AI 代幣工廠基礎設施的計畫擴建,包括透過 USDC 及 ARMS 模組化資料中心平台進行; 本公司紐約州場址的規劃轉型,以及該轉型預期帶來的噪音控制與用水效益;本公司矽谷設施的預期用途與效益;以及本公司人工智慧基礎設施策略的執行情況。 這些陳述係基於管理層當前的預期、估計及假設,並受已知與未知風險、不確定性及其他因素影響,可能導致實際結果與此存在重大差異,包括但不限於:承諾函所載交割條件未能及時或完全滿足或獲豁免,或融資未能按預期條款完成或完全無法完成之風險; 貸款人承諾終止或遭修改的風險;融資款項可能不足以支付所有剩餘的建設及專案成本;初步財務資訊與最終報告結果存在差異的風險;施工延誤、成本超支、供應鏈中斷,以及設備、GPU、勞動力與電力供應的可用性;許可證、分區規劃、環境及其他監管批准;承包商、合作夥伴及交易對手的履約表現; 本公司及其客戶能否依本公司機房託管及其他客戶協議履行義務;融資相關義務;對人工智慧及高效能運算基礎設施的需求;整體經濟、市場及利率狀況;以及本公司最新《10-K 表格年度報告》中「風險因素」部分所述之其他風險與不確定性,以及向美國證券交易委員會提交的其他文件。 謹此提醒讀者,切勿過度依賴前瞻性陳述,該等陳述僅反映本新聞稿發布當日的狀況。除適用法律另有規定外,本公司無義務因新資訊、未來事件或其他原因而更新或修訂任何前瞻性陳述。 消息來源:Digi Power X Inc.
- Digi Power X 宣布获得 2 亿美元债务融资承诺,以支持阿拉巴马州人工智能数据中心的建设,并公布业务扩张最新进展佛罗里达州迈阿密海滩, 2026年10月13日 - (亚太商讯) - Digi Power X Inc.(纳斯达克代码:DGXX) (Cboe Canada:DGX)(“Digi Power X”或“公司”),一家人工智能数据中心基础设施运营商,今日宣布已收到一家主要贷款机构出具的2亿美元债务融资承诺函,用于支持其在阿拉巴马州科伦比亚纳市建设40兆瓦人工智能数据中心的开发。该笔由高盛牵头的银团贷款预计将在90天内完成交割,具体取决于最终文件的签署以及各项条件的满足,包括贷款方完成尽职调查。 该融资将以项目特殊目的实体(“SPV”)为结构主体,由公司提供无担保担保,担保范围涵盖项目完工及若干其他有限事项。融资所得款项将用于支持阿拉巴马州项目的完工及相关项目成本,有助于维持公司流动性、减轻股东权益稀释,并为公司争取更多客户合同奠定基础。 “这项融资承诺是我们在完成阿拉巴马州园区建设的同时,最大限度降低股东股权稀释风险的重要一步。我们正从基础设施建设阶段向创收阶段迈进:阿拉巴马州的建设按计划推进,首个模块化GPU部署已成功运行,且整个项目组合的扩建计划也在稳步推进。” ——Digi Power X Inc.董事长兼首席执行官米歇尔·阿马尔(Michel Amar) 财务状况及阿拉巴马州建设项目进展 截至本文件签署之日,Digi Power X 持有约 1.35 亿美元现金,且 2026 年年初至今的资本支出约为 1.53 亿美元。公司在2026年第三季度未根据其“按市价发行”(“ATM”)股权发行计划发行任何股份,因此该季度未发生与ATM相关的股东股权稀释。 位于阿拉巴马州的40兆瓦园区建设仍按计划推进,预计第一期将于2026年12月完工,第二期将于2027年3月完工。 ARMS 200运营及与Supermicro的合作 公司首个ARMS 200模块化数据中心自2026年5月起运行良好,为其GPU裸机业务提供支持。此次部署彰显了Digi Power X管理支持这些服务的基础设施的能力,包括供电、制冷、数据中心运营及GPU系统。 Digi Power X与超微计算机公司(“Supermicro”)的合作,支持对NVIDIA Blackwell GPU的专用裸机访问,使客户无需自行构建或管理底层基础设施即可部署AI工作负载。Supermicro 近期公开强调了此次合作,突显了其在推动 Digi Power X 全栈 AI 解决方案方面所发挥的作用。 Digi Power X:通过 NeoCloudz 扩展 AI 代币工厂 Digi Power X 计划通过其 NeoCloudz 平台扩展 AI 代币工厂基础设施,利用 US Data Center, Inc.(本公司为其最大股东)的专有 ARMS 模块化数据中心系统,以支持快速部署。此次扩展旨在支持公司计划在GPU裸机服务和AI代币生成领域的增长。在初期ARMS 200部署的基础上,公司计划部署额外的模块化容量,以满足客户需求并增加AI基础设施的经常性收入。 “我们很高兴能在NVIDIA GTC柏林大会上推出我们的AI代币工厂。Digi Power X拥有从电源到数据中心再到计算机的完整技术栈,正因如此,我们才能在规模化应用中提供快速且经济实惠的推理能力。” ——Alec Amar,Digi Power X公司总裁 纽约向AI代币工厂转型 Digi Power X目前正处于规划阶段,计划将其位于纽约州的场地改造为AI代币工厂,以扩大GPU裸机服务和AI代币生成能力。此次改造旨在降低场地噪音水平,并采用闭环冷却系统——该系统通过循环利用冷却液,无需常规蒸发用水,从而最大限度地减少耗水量。 硅谷研发实验室 该公司还收购了位于硅谷的一处办公及实验室设施,用于开发支持其AI代币工厂战略的技术和运营智能。随着GPU基础设施和AI服务的扩展,Digi Power X正汇聚工程、人工智能和软件开发领域的顶尖人才,以加速创新并增强自身能力。 关于 Digi Power X Digi Power X 是一家完全集成的 AI 基础设施公司,拥有并运营从发电、数据中心到运行 AI 工作负载的计算机的全栈服务。公司为企业及超大规模客户提供机房托管服务、裸机 GPU 租赁服务,以及可大规模提供 AI 推理能力的代币工厂。由于掌控着电力、基础设施和计算资源,Digi Power X 能够以更快的速度和更低的成本将运算能力投入使用。如需了解更多信息,请访问 https://www.digipowerx.com/。 投资者关系 如需进一步了解,请联系: Michel Amar,首席执行官 Digi Power X Inc. https://www.digipowerx.com/ 投资者关系:电话:888-474-9222 | 电子邮件:[email protected] 风险提示 本公司证券交易应被视为高度投机性行为。任何证券交易所、证券委员会或其他监管机构均未对本文所含信息予以批准或否决。Cboe Canada 对本新闻稿的充分性或准确性不承担任何责任。 警示声明与前瞻性陈述 本新闻稿包含《1995年私人证券诉讼改革法案》安全港条款所界定的“前瞻性陈述”,以及加拿大适用证券法所定义的“前瞻性信息”(统称“前瞻性陈述”)。除历史事实陈述外,所有陈述均为前瞻性陈述。诸如“预期”、 “相信”、“继续”、“估计”、“预期”、“打算”、“可能”、“计划”、“潜在”、“拟议”、“应”、“目标”、“将”、“会”等词语及类似表述旨在标识前瞻性陈述,尽管并非所有前瞻性陈述都包含这些词语。 本新闻稿中的前瞻性陈述包括但不限于以下内容:关于拟议的2亿美元债务融资的陈述,包括交割和资金到位的时间安排,以及满足交割条件的情况,包括贷款方满足尽职调查要求;预计的募集资金用途,包括用于支付剩余建设及相关项目成本,以及对公司流动性和股东权益稀释的预期影响; 公司位于阿拉巴马州科伦比亚纳的40兆瓦AI数据中心第一期和第二期的进展、时间表及完工情况,公司争取更多客户合同并产生经常性收入的能力;公司AI代币工厂基础设施的计划扩建,包括通过USDC和ARMS模块化数据中心平台进行的扩建; 公司计划对纽约州站点进行的改造,以及该改造预计带来的降噪和节水效益;公司硅谷设施的预期用途及效益;以及公司人工智能基础设施战略的执行情况。 这些陈述基于管理层当前的预期、估计和假设,并受已知和未知风险、不确定性及其他因素的影响,这些因素可能导致实际结果与预期存在重大差异,包括但不限于:承诺函中规定的交割条件未能及时满足或豁免,甚至完全无法满足或豁免;融资未能按预期条款完成,甚至完全无法完成; 贷款人承诺终止或被修改的风险;融资所得款项可能不足以支付所有剩余建设及项目成本;初步财务信息与最终报告结果存在差异的风险;施工延误、成本超支、供应链中断以及设备、GPU、劳动力和电力供应的可用性;许可、分区、环境及其他监管审批;承包商、合作伙伴及交易对手的履约情况; 本公司及其客户履行本公司机房托管及其他客户协议的能力;融资项下的义务;对人工智能和高性能计算基础设施的需求;总体经济、市场及利率状况;以及本公司最新10-K表格年度报告及向美国证券交易委员会提交的其他文件中“风险因素”部分所述的其他风险和不确定性。 谨此提醒读者,切勿过度依赖前瞻性陈述,此类陈述仅反映本新闻稿发布之日的状况。除适用法律要求外,本公司不承担因新信息、未来事件或其他原因而更新或修订任何前瞻性陈述的义务。 来源:Digi Power X Inc. Copyright 2026 亚太商讯. All rights reserved. www.acnnewswire.com
- Digi Power X Inc.Digi Power X Announces $200 Million Debt Financing Commitment to Support Completion of Alabama AI Data Center and Provides Expansion UpdateMIAMI BEACH, FL, Oct 13, 2026 - Digi Power X Inc. (Nasdaq:DGXX)(Cboe Canada:DGX) ("Digi Power X" or the "Company"), an AI data center infrastructure operator, today announced that it has received a commitment letter from a major lending institution for US$200 million in debt financing to support the development of its 40 MW AI data center in Columbiana, Alabama. The financing, syndicated by Goldman Sachs, is expected to close within 90 days, subject to definitive documentation and satisfaction of various conditions, including the lender's completion of its diligence efforts. The financing is to be structured at a project special purpose vehicle ("SPV") level, with an unsecured Company guarantee through project completion and other limited matters. Proceeds are intended to support completion of the Alabama project and related project costs, helping preserve corporate liquidity, mitigate shareholder dilution and position the Company to pursue additional customer contracts. "This financing commitment is an important step toward completing our Alabama campus while limiting dilution for our shareholders. We are progressing from infrastructure development toward revenue generation, with construction on schedule in Alabama, our first modular GPU deployment operating successfully, and expansion plans advancing across our portfolio." - Michel Amar, Chairman & Chief Executive Officer, Digi Power X Inc. Financial Position and Alabama Construction Update As of the date hereof, Digi Power X held approximately US$135 million in cash and invested approximately US$153 million in capital expenditures year to date in 2026. The Company did not issue any shares under its at-the-market ("ATM") equity offering program during the third quarter of 2026, resulting in no ATM-related shareholder dilution during the quarter. Construction at the 40 MW Alabama campus remains on target, with Phase 1 expected to be completed in December 2026 and Phase 2 in March 2027. ARMS 200 Operations and Supermicro Partnership The Company's first ARMS 200 modular data center has been operating successfully since May 2026, supporting its GPU bare-metal business. The deployment demonstrates Digi Power X's ability to manage the infrastructure supporting these services, including power, cooling, data center operations and GPU systems. Digi Power X's partnership with Super Micro Computer, Inc. ("Supermicro") supports dedicated, bare-metal access to NVIDIA Blackwell GPUs, enabling customers to deploy AI workloads without building or managing the underlying infrastructure themselves. Supermicro recently highlighted the collaboration publicly, underscoring its role in powering Digi Power X's full-stack AI offering. Digi Power X: Expanding the AI Token Factory Through NeoCloudz Digi Power X plans to expand its AI token factory infrastructure through its NeoCloudz platform, using the proprietary ARMS modular data center systems of US Data Center, Inc., a subsidiary of which the Company is the largest shareholder, to support fast deployment. This expansion is intended to support the Company's planned growth in GPU bare-metal services and AI token generation. Building on its initial ARMS 200 deployment, the Company intends to deploy additional modular capacity to meet customer demand and grow recurring AI infrastructure revenue. "We're excited to unveil our AI token factory at NVIDIA GTC Berlin. Digi Power X owns the whole stack, from the power to the data center to the computer, and that's how we deliver fast, affordable inference at scale." - Alec Amar, President, Digi Power X Inc. New York Transition to AI Token Factories Digi Power X is in the planning phase to repurpose its New York State sites into AI token factories, expanding capacity for GPU bare-metal services and AI token generation. The planned conversion is designed to reduce site noise levels and incorporate closed-loop cooling systems designed to minimize water consumption by recirculating coolant without routine evaporative water use. Silicon Valley Development Lab The Company has also acquired an office and laboratory facility in Silicon Valley to develop the technology and operational intelligence supporting its AI token factory strategy. Digi Power X is bringing together top talent in engineering, artificial intelligence and software development to accelerate innovation and strengthen its capabilities as it expands its GPU infrastructure and AI services. About Digi Power X Digi Power X is a fully integrated AI infrastructure company that owns and operates the whole stack, from power generation and data centers to the computers that run AI workloads. The Company offers colocation for enterprise and hyperscale customers, bare metal GPU rental and a token factory that delivers AI inference at scale. Because it controls the power, the infrastructure and the compute, Digi Power X can bring capacity online faster and more affordably. For more information, visit www.digipowerx.com. Investor Relations For further information, please contact: Michel Amar, Chief Executive Officer Digi Power X Inc. www.digipowerx.com Investor Relations: T: 888-474-9222 | Email: [email protected] Cautionary Statement Trading in the securities of the Company should be considered highly speculative. No stock exchange, securities commission or other regulatory authority has approved or disapproved the information contained herein. Cboe Canada does not accept responsibility for the adequacy or accuracy of this release. Cautionary Note and Forward-Looking Statements This press release contains "forward-looking statements" within the safe harbor provisions of the Private Securities Litigation Reform Act of 1995, and "forward-looking information" within the meaning of applicable Canadian securities laws (collectively, "forward-looking statements"). All statements other than statements of historical fact are forward-looking statements. Words such as "anticipate," "believe," "continue," "estimate," "expect," "intend," "may," "plan," "potential," "proposed," "should," "target," "will," "would" and similar expressions are intended to identify forward-looking statements, although not all forward-looking statements contain these words. Forward-looking statements in this press release include, without limitation, statements regarding: the proposed $200 million debt financing, including the timing of closing and funding, and the satisfaction of conditions to closing, including lender satisfaction of its diligence requirements; the expected use of proceeds, including the funding of remaining construction and related project costs, and the anticipated effects on corporate liquidity and shareholder dilution; the progress, schedule and completion of Phase 1 and Phase 2 of the Company's 40 MW AI data center in Columbiana, Alabama, the Company's ability to pursue additional customer contracts and generate recurring revenue; the planned expansion of the Company's AI token factory infrastructure, including through USDC and the ARMS modular data center platform; the planned conversion of the Company's New York State sites and the anticipated noise and water use benefits of that conversion; the anticipated use and benefits of the Company's Silicon Valley facility; and the execution of the Company's AI infrastructure strategy. These statements are based on management's current expectations, estimates and assumptions and are subject to known and unknown risks, uncertainties and other factors that could cause actual results to differ materially, including, among others: the risk that the conditions to closing under the commitment letter are not satisfied or waived on a timely basis or at all, or that the financing is not completed on the anticipated terms or at all; the risk that the lender's commitment terminates or is modified; the possibility that financing proceeds will be insufficient to fund all remaining construction and project costs; the risk that preliminary financial information differs from final reported results; construction delays, cost overruns, supply chain disruptions and the availability of equipment, GPUs, labor and power; permitting, zoning, environmental and other regulatory approvals; the performance of contractors, partners and counterparties; the ability of the Company and its customers to perform under the Company's colocation and other customer agreements; obligations under the financing; demand for AI and high-performance computing infrastructure; general economic, market and interest rate conditions; and the other risks and uncertainties described under "Risk Factors" in the Company's most recent Annual Report on Form 10-K and other filings with the U.S. Securities and Exchange Commission. Readers are cautioned not to place undue reliance on forward-looking statements, which speak only as of the date of this press release. Except as required by applicable law, the Company undertakes no obligation to update or revise any forward-looking statement, whether as a result of new information, future events or otherwise. SOURCE: Digi Power X Inc.
- Autumn Electronics Fair and electronicAsia open today bringing global buyers to Hong KongHong Kong, Oct 13, 2026 - The Hong Kong Electronics Fair (Autumn Edition), organised by the Hong Kong Trade Development Council (HKTDC), and electronicAsia, jointly organised by the HKTDC and MMI Asia Pte Ltd, opened today at the Hong Kong Convention and Exhibition Centre. Running for four consecutive days, the twin fairs showcase a broad spectrum of innovations spanning consumer electronics, artificial intelligence (AI), robotics technologies, smart living, immersive entertainment, electronic components and advanced manufacturing technologies, providing global buyers with a one-stop sourcing and networking platform. Making its debut this year, the Future Industries Zone spotlights five frontier sectors and showcases emerging trends shaping the industries of tomorrow. The Autumn Electronics Fair and eAsia opened today at the Hong Kong Convention and Exhibition Centre, where the fairs will run for four consecutive days Speaking at the opening ceremony for the Future Industries Zone this morning, Sophia Chong, HKTDC Executive Director, said: "The Future Industries Zone reflects our commitment to evolve our fairs alongside the industry, while supporting the strategic direction set out in the Policy Address and the First Five-Year Plan to develop Hong Kong into an international innovation and technology centre. This year's Hong Kong Electronics Fair (Autumn Edition) and electronicAsia are bringing together over 3,200 exhibitors from 15 countries and regions. Another key highlight is the expanded RoboPark that showcases not only the latest robotics technologies, but also their growing applications in everyday life and across industries. The HKTDC is one of the core members of the government-led GoGlobal Task Force and we will make good use of one of the world's leading marketplaces to feature the GoGlobal Connect Zone, which offers advisory services and practical support to help enterprises - particularly those from the Chinese Mainland - expand internationally through Hong Kong. The zone reflects the HKTDC's commitment to reinforcing Hong Kong's role as a platform for global expansion, capitalising on its strengths as a superconnector and super value-adder." Sophia Chong, Executive Director of the Hong Kong Trade Development Council, delivers remarks at the opening ceremony for the Future Industries Zone The Autumn Electronics Fair has introduced the new Future Industries Zone this year, with an opening ceremony held this morning. Kevin Choi, Permanent Secretary for Innovation, Technology and Industry of HKSARG (front row, fourth from left); Sophia Chong, Executive Director of the Hong Kong Trade Development Council (front row, fourth from right); and Paul So, Chairman of the Hong Kong Electronic Industries Association (front row, third from left), joined the event with other distinguished guests In addition to Hong Kong exhibitors, the fairs feature exhibitors from the Chinese Mainland, Macao and Taiwan, as well as countries across the Asia-Pacific region including Korea and Singapore. Exhibitors from Europe and other overseas markets, including Denmark, the United Kingdom, Germany, Switzerland, Spain and Cyprus, are also participating, showcasing a wide range of the latest electronics products and advanced technologies. On the opening day of the fairs, buyers from around the world gathered to explore sourcing opportunities. The HKTDC has organised 130 buying missions comprising buyers from 65 countries and regions to visit and source at the fairs, further reinforcing Hong Kong's role as a platform connecting international markets with innovative supply chains. Future Industries Zone debuts, showcasing synergies across five key themes In support of the Government's drive to develop Hong Kong into an international innovation and technology centre and deepen AI development and adoption in the city, this year's Autumn Electronics Fair has launched the new Future Industries Zone, jointly organised by the HKTDC and the Hong Kong Electronic Industries Association (HKEIA) and supported by the Innovation, Technology and Industry Bureau of the Hong Kong SAR Government. Led by major innovation and technology institutions, including Cyberport, the Hong Kong Science and Technology Parks Corporation and the Hong Kong Productivity Council, the zone focuses on five key themes: Future Computing, Future Manufacturing, Future Marine & Quantum Technologies, Future Microelectronics and Future Wellness. The newly launched Future Industries Zone at the Autumn Electronics Fair focuses on five key themes: Future Computing, Future Manufacturing, Future Marine & Quantum Technologies, Future Microelectronics and Future Wellness Bringing together more than 100 exhibitors, the Future Industries Zone showcases cutting-edge technologies and innovative application solutions. The zone also features a series of thematic forums and networking events, welcoming representatives from government, industry, academia, research and investment sectors to explore opportunities in future industry development. A distinguished lineup of speakers has been invited to share insights on emerging technologies and industry trends. At a thematic forum to be held tomorrow (14 October), experts and representatives from leading global companies and organisations, including AWS, IBM, Lenovo and HPE, will share insights into global trends in cross-industry business transformation and innovation-driven technology development. Other activities also feature a distinguished lineup of speakers, including Prof Wang Yang, Vice-President of The University of Hong Kong; Dr Wang Jun, Deputy Executive President of the Bank of China Group Investment Limited; and He Jun, Vice-President of TCL Industries Holdings Co., Ltd. They will share their professional insights on technology innovation, industrial development and emerging opportunities. GoGlobal Connect Zone offers professional service matching for enterprises As a member of the Government's GoGlobal Task Force, the HKTDC has established a dedicated GoGlobal Connect Zone at the Autumn Electronics Fair. This brings together professional service providers from the finance, legal, accounting and insurance sectors to assist businesses in areas such as financing, intellectual property, logistics, compliance and risk management, helping Chinese Mainland enterprises connect with international markets through Hong Kong’s professional services platform. The fair features a series of GoGlobal activities, including the "GoGlobal: Scaling Smart Consumer Innovations Worldwide" seminar at which representatives from Hang Seng Bank, the Hong Kong Export Credit Insurance Corporation and other industry and financial organisations will share insights on key strategies for overseas expansion The fairs also feature a series of forums focusing on overseas market expansion. Representatives from OCBC Bank will share insights tomorrow afternoon (14 October) on the manufacturing ecosystem in the ASEAN bloc, helping companies interested in entering markets in these countries better understand the region's economic environment, tax regimes, market trends and business development opportunities. Over 120 robots highlight real-world applications of robotics technologies This year's Autumn Electronics Fair focuses on the latest consumer electronics products and innovative technologies under three highlighted themes: AI & Robotics, Smart Wellness and NEXTEntertainment. Related products are featured across different thematic zones throughout the exhibition. More than 120 robots are showcased at this year's fair, primarily within RoboPark, demonstrating applications across four key areas: Commercial & Services, Industrial & Logistics, Entertainment & Social, and Healthcare & Rehabilitation. Highlights include AgiBot Innovation (Shanghai) Technology Co., Ltd (Booth: 3CON-R31) and its full-sized humanoid robot Agibot A3; UBTECH (Booth: 3CON-R27), one of the "Shenzhen Eight Great Guardians", which is exhibiting its next-generation full-sized humanoid robot Walker C1, developed for urban coexistence; and DEEP Robotics (Booth: 3CON-R19), one of the "Hangzhou Six Little Dragons", displaying its quadruped robots Lite3 and M20. Other renowned exhibitors include the Shenzhen Honor Smart Technology Development Co., Ltd. (Booth: 3CON-R37), whose humanoid robot was the winner of the 2026 Beijing E-Town Half Marathon, and Booster Robotics (Booth: GH-R13), champion of the 2026 RoboCup. A number of well-known technology companies from the "Shenzhen Eight Great Guardians" and "Hangzhou Six Little Dragons" are also showcasing their latest innovations, including AI² Robotics (Booth: GH-Q01), Digit (Booth: 3CON-R49), EngineAI (Booth: 3CON-R52) and first-time exhibitor DexForce (Booth: GH-R07). The fair features several leading technology companies, including Booster Robotics (Booth: GH-R13), champion of the 2026 RoboCup, which showcases its latest innovations and technological achievements RoboPark features multiple demonstration and experience zones, enabling buyers to explore how robotics technologies are being integrated into industries and everyday life. They include the RoboDog Garden, showcasing robotic dogs; the Robot Dance Battle, featuring dance performances by robots; and the Coffee & Popcorn Station, where robots prepare snacks and drinks, allowing visitors to experience the practical application potential of robotics at first hand. RoboPark features multiple interactive experience and demonstration zones. At the "Coffee & Popcorn Station", robots prepare snacks and drinks for visitors New products highlight AI integration across healthcare, lifestyle and entertainment Smart Wellness encompasses digital health devices, smart wearables, personal care technologies, gerontech and healthy living electronics, reflecting strong market demand for technology-enabled health management and improved quality of life. Smart Wellness is another key focus of the Autumn Electronics Fair, with exhibitors showcasing innovative solutions ranging from digital health devices and smart wearables to personal care technologies, gerontech and healthy living electronics. Many exhibitors are leveraging the fair as a platform to showcase newly introduced products. Future Access Technology Co., Limited (Booth: 1C-D06) is presenting the LYRA, a screen-free smart wristband designed to minimise distractions and help users focus on daily life activities while supporting personalised fitness programmes and more than 170 sports modes. Cheung Shing Development (H.K.) Limited (Booth: 3D-E06) is displaying its latest Hearing Aid Glasses for people with mild to moderate hearing loss. Equipped with sound amplification technology, the glasses improve speech clarity in noisy environments and enhance communication experiences. NEXTEntertainment features extended reality (XR) technologies, smart gaming devices, digital content creation tools, AI-powered entertainment solutions and innovative consumer electronics designed to enhance both entertainment experiences and digital content creation. Among the highlights, DreamGear LLC (Booth: 1D-C09) is showcasing a new rechargeable retro gaming console featuring more than 200 built-in classic games, smart backlit button prompts and multiple control modes, combining nostalgic arcade gaming with modern innovation. The Autumn Electronics Fair features more than 20 exhibition zones. The Hall of Fame brings together over 560 renowned brands, including first-time exhibitors Aoni (Booth: 1A-D02) and HEAD (Booth: 1C-A12). RISE Avenue highlights emerging brands including Beijing Huahon Data Technology Co., Ltd. (Booth: 1CON-003), which is making its global debut with the All-in-One Liquid-Cooled AI Computing System, providing powerful computing capabilities for large-model training, AI inference and visual rendering through advanced liquid-cooling technology. The Adventure Hub features the Immersive Experience Zone, showcasing the latest applications of XR technologies, brain-computer interfaces and other creative technologies. Highlights include a brainwave-controlled claw machine from Yugu Technology (Booth: 5E-D12). Meanwhile, the Tech Hall focuses on AI, professional data and Internet of Things (IoT) solutions. Among the exhibitors, Guangzhou Quwan Network Technology Co., Ltd (Booth: CH-H10) is presenting the TemPolor Melo-D Generative AI Guitar, which integrates AI into music creation. Users simply upload their favourite songs and the system generates fingerstyle melodies while providing illuminated guidance on the guitar body and display screen to assist performance. More than 120 start-ups connecting with opportunities The fairs also bring together more than 120 promising young enterprises and start-ups, primarily in the Startup Zone. The IOT HK Association Limited and JimHang Academy are each leading groups of start-ups showcasing technologies and solutions designed to address real-world business challenges. A range of supporting activities will also be held, including investment matching sessions, the Hong Kong Value Creation for Technology: Pitching Competition and mentorship programmes, helping start-ups refine their business models, expand investor networks and strengthen their market competitiveness. The fair brings together more than 120 promising young enterprises and start-ups, primarily showcased within the Startup Zone electronicAsia connects the electronics supply chain Held concurrently with the Autumn Electronics Fair, electronicAsia (eAsia) features multiple thematic zones covering electronic components, display technologies, printed circuit boards and electronic manufacturing services, as well as testing and measurement instruments. Together, the two fairs create a comprehensive one-stop sourcing platform spanning the entire electronics industry supply chain. eAsia features a wide range of electronic components, display technologies, printed circuit boards, electronics manufacturing services and testing instruments, forming a one-stop sourcing platform together with the Autumn Electronics Fair Among the exhibitors at eAsia, Rapid Conn (S) Pte. Ltd. (Booth: 5B-C10) is showcasing advanced interconnect solutions, while Surface Mount Technology Ltd. (Booth: 5B-D01) is presenting cutting- edge AI and AIoT solutions. The fairs also feature a rich programme of forums and seminars. The 11th Symposium on Innovation & Technology, jointly organised by HKTDC and the Hong Kong Electronics and Technologies Association, takes place today under the theme "AI-Driven Security & The Next-Gen Infrastructure". Speakers include Alexander Gerfer, Chief Technology Officer of Würth Elektronik Group; Dr Charles Cheung, Adjunct Associate Professor in the Department of Mathematics at Hong Kong Baptist University; and Silvia Ihensekhien, Chief Security Advisor, Greater China at Microsoft. The Symposium on Innovation & Technology, jointly organised by HKTDC and the Hong Kong Electronics and Technologies Association, takes place today under the theme "AI-Driven Security & The Next-Gen Infrastructure" In addition, the Hong Kong Electronic Forum, jointly organised by the HKTDC, MMI Asia Pte Ltd and the Hong Kong Electronic Industries Association, with support from the Electronics Division of The Hong Kong Institution of Engineers, will be held on 15 October under the theme "Future Tech: Powering Electronics Competitiveness with AI and Sustainable Innovation", exploring how AI, sustainability and technological innovation are reshaping the future of the electronics sector. Under the EXHIBITION+ hybrid model, exhibitors and buyers can meet online through the HKTDC Click2Match smart business matching platform in addition to attending the physical fairs. The online exhibitions for the Hong Kong Electronics Fair (Autumn Edition) and electronicAsia run from 6 to 23 October. Photo download: https://bit.ly/4AVhNOu Websites - Hong Kong Electronics Fair (Autumn Edition): https://www.hktdc.com/event/hkelectronicsfairae/en- electronicAsia: https://www.hktdc.com/event/electronicasia/en Media enquiries Please contact the HKTDC’s Communications & Public Affairs Department: Katy Wong Tel: (852) 2584 4524 Email: [email protected] Clayton Lauw Tel: (852) 2584 4472 Email: [email protected] HKTDC Media Room: https://mediaroom.hktdc.com/en About HKTDC The Hong Kong Trade Development Council (HKTDC) celebrates its 60th anniversary this year. The HKTDC is a statutory body established in 1966 to promote, assist and develop Hong Kong's trade. With over 50 offices globally, including 13 in the Chinese Mainland, the HKTDC promotes Hong Kong as a two-way global investment and business hub. The HKTDC organises international exhibitions, conferences and business missions to create business opportunities for companies, particularly small and medium-sized enterprises (SMEs), in the mainland and international markets. The HKTDC also provides up-to-date market insights and product information via trade publications, research reports and digital news channels. For more information, please visit: www.hktdc.com/aboutus.
- H3C CAS Named a Visionary in Gartner(R) Magic Quadrant(TM) for Server Virtualization PlatformsBEIJING, Oct 13, 2026 - On September 14, Gartner released its Magic Quadrant™ for Server Virtualization Platforms. H3C CAS is positioned as a Visionary in the 2026 Gartner® Magic Quadrant™ for Server Virtualization Platforms, making H3C one of the few Chinese vendors included in the report. This recognition reflects H3C CAS's continued innovation and capabilities in server virtualization. Beyond Virtualization: A Stable Foundation for Mission-Critical Workloads As cloud computing continues to evolve, server virtualization remains a key foundation for enterprise IT infrastructure. At the same time, the growth of AI, diverse computing architectures, and the coexistence of virtual machines and containers are creating new requirements for virtualization platforms. H3C CAS has evolved from a compute virtualization platform into an enterprise virtualization and cloud management platform covering compute, storage, networking, security, and unified management. It supports x86, ARM, and a broad range of operating systems and hardware. Key capabilities include: 1. Improved resource utilization with NVMe SSD-based intelligent memory overcommitment. 2. Optimized VM scheduling with automatic VM NUMA binding. 3. Support for AI workloads with capabilities such as vGPU live migration. From Virtual Machines to Containers: One Platform for Application Modernization As virtual machines and containers increasingly coexist in enterprise data centers, organizations need a unified infrastructure platform to support both traditional and cloud-native applications. H3C CAS integrates virtualization and cloud-native technologies through native Kubernetes integration and container cluster services, enabling unified management of VM and container resources. CAS also provides virtual networking and network services, including Open vSwitch, bandwidth management, traffic prioritization, firewalls, load balancing, and micro-segmentation. Support for RoCE v2 and SR-IOV further enables high-performance and AI workloads. Evolving Virtualization for the AI Era As IT infrastructure evolves from server virtualization to cloud and AI infrastructure, enterprises continue to require stable, secure, efficient, and future-ready platforms. The Visionary positioning in the Gartner Magic Quadrant reflects the global competitiveness of H3C CAS in server virtualization. Today, CAS serves more than 15,000 customers, with 500,000+ CPUs running online, across industries including government, finance, education, and broadcasting and television. Looking ahead, H3C will continue to integrate server virtualization with AI computing, GPU resource management, and cloud-native technologies, helping customers build more efficient and intelligent infrastructure for next-generation data centers. Disclaimer: Source:Gartner, Magic Quadrant for Server Virtualization Platforms, 14 September 2026 GARTNER and Magic Quadrant are registered trademarks of Gartner, Inc. and/or its affiliates in the U.S. and internationally and are used herein with permission. All rights reserved. Gartner does not endorse any vendor, product or service depicted in its research publications, and does not advise technology users to select only those vendors with the highest ratings or other designation. Gartner research publications consist of the opinions of Gartner's research organization and should not be construed as statements of fact. Gartner disclaims all warranties, expressed or implied, with respect to this research, including any warranties of merchantability or fitness for a particular purpose. H3C Jingwen Zeng [email protected] https://www.h3c.com/en/
- Autumn Electronics Fair and electronicAsia open today bringing global buyers to Hong KongHong Kong, Oct 13, 2026 - The Hong Kong Electronics Fair (Autumn Edition), organised by the Hong Kong Trade Development Council (HKTDC), and electronicAsia, jointly organised by the HKTDC and MMI Asia Pte Ltd, opened today at the Hong Kong Convention and Exhibition Centre. Running for four consecutive days, the twin fairs showcase a broad spectrum of innovations spanning consumer electronics, artificial intelligence (AI), robotics technologies, smart living, immersive entertainment, electronic components and advanced manufacturing technologies, providing global buyers with a one-stop sourcing and networking platform. Making its debut this year, the Future Industries Zone spotlights five frontier sectors and showcases emerging trends shaping the industries of tomorrow. The Autumn Electronics Fair and eAsia opened today at the Hong Kong Convention and Exhibition Centre, where the fairs will run for four consecutive days Speaking at the opening ceremony for the Future Industries Zone this morning, Sophia Chong, HKTDC Executive Director, said: "The Future Industries Zone reflects our commitment to evolve our fairs alongside the industry, while supporting the strategic direction set out in the Policy Address and the First Five-Year Plan to develop Hong Kong into an international innovation and technology centre. This year's Hong Kong Electronics Fair (Autumn Edition) and electronicAsia are bringing together over 3,200 exhibitors from 15 countries and regions. Another key highlight is the expanded RoboPark that showcases not only the latest robotics technologies, but also their growing applications in everyday life and across industries. The HKTDC is one of the core members of the government-led GoGlobal Task Force and we will make good use of one of the world's leading marketplaces to feature the GoGlobal Connect Zone, which offers advisory services and practical support to help enterprises - particularly those from the Chinese Mainland - expand internationally through Hong Kong. The zone reflects the HKTDC's commitment to reinforcing Hong Kong's role as a platform for global expansion, capitalising on its strengths as a superconnector and super value-adder." Sophia Chong, Executive Director of the Hong Kong Trade Development Council, delivers remarks at the opening ceremony for the Future Industries ZoneThe Autumn Electronics Fair has introduced the new Future Industries Zone this year, with an opening ceremony held this morning. Kevin Choi, Permanent Secretary for Innovation, Technology and Industry of HKSARG (front row, fourth from left); Sophia Chong, Executive Director of the Hong Kong Trade Development Council (front row, fourth from right); and Paul So, Chairman of the Hong Kong Electronic Industries Association (front row, third from left), joined the event with other distinguished guests In addition to Hong Kong exhibitors, the fairs feature exhibitors from the Chinese Mainland, Macao and Taiwan, as well as countries across the Asia-Pacific region including Korea and Singapore. Exhibitors from Europe and other overseas markets, including Denmark, the United Kingdom, Germany, Switzerland, Spain and Cyprus, are also participating, showcasing a wide range of the latest electronics products and advanced technologies. On the opening day of the fairs, buyers from around the world gathered to explore sourcing opportunities. The HKTDC has organised 130 buying missions comprising buyers from 65 countries and regions to visit and source at the fairs, further reinforcing Hong Kong's role as a platform connecting international markets with innovative supply chains. Future Industries Zone debuts, showcasing synergies across five key themes In support of the Government's drive to develop Hong Kong into an international innovation and technology centre and deepen AI development and adoption in the city, this year's Autumn Electronics Fair has launched the new Future Industries Zone, jointly organised by the HKTDC and the Hong Kong Electronic Industries Association (HKEIA) and supported by the Innovation, Technology and Industry Bureau of the Hong Kong SAR Government. Led by major innovation and technology institutions, including Cyberport, the Hong Kong Science and Technology Parks Corporation and the Hong Kong Productivity Council, the zone focuses on five key themes: Future Computing, Future Manufacturing, Future Marine & Quantum Technologies, Future Microelectronics and Future Wellness. The newly launched Future Industries Zone at the Autumn Electronics Fair focuses on five key themes: Future Computing, Future Manufacturing, Future Marine & Quantum Technologies, Future Microelectronics and Future Wellness Bringing together more than 100 exhibitors, the Future Industries Zone showcases cutting-edge technologies and innovative application solutions. The zone also features a series of thematic forums and networking events, welcoming representatives from government, industry, academia, research and investment sectors to explore opportunities in future industry development. A distinguished lineup of speakers has been invited to share insights on emerging technologies and industry trends. At a thematic forum to be held tomorrow (14 October), experts and representatives from leading global companies and organisations, including AWS, IBM, Lenovo and HPE, will share insights into global trends in cross-industry business transformation and innovation-driven technology development. Other activities also feature a distinguished lineup of speakers, including Prof Wang Yang, Vice-President of The University of Hong Kong; Dr Wang Jun, Deputy Executive President of the Bank of China Group Investment Limited; and He Jun, Vice-President of TCL Industries Holdings Co., Ltd. They will share their professional insights on technology innovation, industrial development and emerging opportunities. GoGlobal Connect Zone offers professional service matching for enterprises As a member of the Government's GoGlobal Task Force, the HKTDC has established a dedicated GoGlobal Connect Zone at the Autumn Electronics Fair. This brings together professional service providers from the finance, legal, accounting and insurance sectors to assist businesses in areas such as financing, intellectual property, logistics, compliance and risk management, helping Chinese Mainland enterprises connect with international markets through Hong Kong’s professional services platform. The fair features a series of GoGlobal activities, including the "GoGlobal: Scaling Smart Consumer Innovations Worldwide" seminar at which representatives from Hang Seng Bank, the Hong Kong Export Credit Insurance Corporation and other industry and financial organisations will share insights on key strategies for overseas expansion The fairs also feature a series of forums focusing on overseas market expansion. Representatives from OCBC Bank will share insights tomorrow afternoon (14 October) on the manufacturing ecosystem in the ASEAN bloc, helping companies interested in entering markets in these countries better understand the region's economic environment, tax regimes, market trends and business development opportunities. Over 120 robots highlight real-world applications of robotics technologies This year's Autumn Electronics Fair focuses on the latest consumer electronics products and innovative technologies under three highlighted themes: AI & Robotics, Smart Wellness and NEXTEntertainment. Related products are featured across different thematic zones throughout the exhibition. More than 120 robots are showcased at this year's fair, primarily within RoboPark, demonstrating applications across four key areas: Commercial & Services, Industrial & Logistics, Entertainment & Social, and Healthcare & Rehabilitation. Highlights include AgiBot Innovation (Shanghai) Technology Co., Ltd (Booth: 3CON-R31) and its full-sized humanoid robot Agibot A3; UBTECH (Booth: 3CON-R27), one of the "Shenzhen Eight Great Guardians", which is exhibiting its next-generation full-sized humanoid robot Walker C1, developed for urban coexistence; and DEEP Robotics (Booth: 3CON-R19), one of the "Hangzhou Six Little Dragons", displaying its quadruped robots Lite3 and M20. Other renowned exhibitors include the Shenzhen Honor Smart Technology Development Co., Ltd. (Booth: 3CON-R37), whose humanoid robot was the winner of the 2026 Beijing E-Town Half Marathon, and Booster Robotics (Booth: GH-R13), champion of the 2026 RoboCup. A number of well-known technology companies from the "Shenzhen Eight Great Guardians" and "Hangzhou Six Little Dragons" are also showcasing their latest innovations, including AI² Robotics (Booth: GH-Q01), Digit (Booth: 3CON-R49), EngineAI (Booth: 3CON-R52) and first-time exhibitor DexForce (Booth: GH-R07). The fair features several leading technology companies, including Booster Robotics (Booth: GH-R13), champion of the 2026 RoboCup, which showcases its latest innovations and technological achievements RoboPark features multiple demonstration and experience zones, enabling buyers to explore how robotics technologies are being integrated into industries and everyday life. They include the RoboDog Garden, showcasing robotic dogs; the Robot Dance Battle, featuring dance performances by robots; and the Coffee & Popcorn Station, where robots prepare snacks and drinks, allowing visitors to experience the practical application potential of robotics at first hand. RoboPark features multiple interactive experience and demonstration zones. At the "Coffee & Popcorn Station", robots prepare snacks and drinks for visitors New products highlight AI integration across healthcare, lifestyle and entertainment Smart Wellness encompasses digital health devices, smart wearables, personal care technologies, gerontech and healthy living electronics, reflecting strong market demand for technology-enabled health management and improved quality of life. Smart Wellness is another key focus of the Autumn Electronics Fair, with exhibitors showcasing innovative solutions ranging from digital health devices and smart wearables to personal care technologies, gerontech and healthy living electronics. Many exhibitors are leveraging the fair as a platform to showcase newly introduced products. Future Access Technology Co., Limited (Booth: 1C-D06) is presenting the LYRA, a screen-free smart wristband designed to minimise distractions and help users focus on daily life activities while supporting personalised fitness programmes and more than 170 sports modes. Cheung Shing Development (H.K.) Limited (Booth: 3D-E06) is displaying its latest Hearing Aid Glasses for people with mild to moderate hearing loss. Equipped with sound amplification technology, the glasses improve speech clarity in noisy environments and enhance communication experiences. NEXTEntertainment features extended reality (XR) technologies, smart gaming devices, digital content creation tools, AI-powered entertainment solutions and innovative consumer electronics designed to enhance both entertainment experiences and digital content creation. Among the highlights, DreamGear LLC (Booth: 1D-C09) is showcasing a new rechargeable retro gaming console featuring more than 200 built-in classic games, smart backlit button prompts and multiple control modes, combining nostalgic arcade gaming with modern innovation. The Autumn Electronics Fair features more than 20 exhibition zones. The Hall of Fame brings together over 560 renowned brands, including first-time exhibitors Aoni (Booth: 1A-D02) and HEAD (Booth: 1C-A12). RISE Avenue highlights emerging brands including Beijing Huahon Data Technology Co., Ltd. (Booth: 1CON-003), which is making its global debut with the All-in-One Liquid-Cooled AI Computing System, providing powerful computing capabilities for large-model training, AI inference and visual rendering through advanced liquid-cooling technology. The Adventure Hub features the Immersive Experience Zone, showcasing the latest applications of XR technologies, brain-computer interfaces and other creative technologies. Highlights include a brainwave-controlled claw machine from Yugu Technology (Booth: 5E-D12). Meanwhile, the Tech Hall focuses on AI, professional data and Internet of Things (IoT) solutions. Among the exhibitors, Guangzhou Quwan Network Technology Co., Ltd (Booth: CH-H10) is presenting the TemPolor Melo-D Generative AI Guitar, which integrates AI into music creation. Users simply upload their favourite songs and the system generates fingerstyle melodies while providing illuminated guidance on the guitar body and display screen to assist performance. More than 120 start-ups connecting with opportunities The fairs also bring together more than 120 promising young enterprises and start-ups, primarily in the Startup Zone. The IOT HK Association Limited and JimHang Academy are each leading groups of start-ups showcasing technologies and solutions designed to address real-world business challenges. A range of supporting activities will also be held, including investment matching sessions, the Hong Kong Value Creation for Technology: Pitching Competition and mentorship programmes, helping start-ups refine their business models, expand investor networks and strengthen their market competitiveness. The fair brings together more than 120 promising young enterprises and start-ups, primarily showcased within the Startup Zone electronicAsia connects the electronics supply chain Held concurrently with the Autumn Electronics Fair, electronicAsia (eAsia) features multiple thematic zones covering electronic components, display technologies, printed circuit boards and electronic manufacturing services, as well as testing and measurement instruments. Together, the two fairs create a comprehensive one-stop sourcing platform spanning the entire electronics industry supply chain. eAsia features a wide range of electronic components, display technologies, printed circuit boards, electronics manufacturing services and testing instruments, forming a one-stop sourcing platform together with the Autumn Electronics Fair Among the exhibitors at eAsia, Rapid Conn (S) Pte. Ltd. (Booth: 5B-C10) is showcasing advanced interconnect solutions, while Surface Mount Technology Ltd. (Booth: 5B-D01) is presenting cutting- edge AI and AIoT solutions. The fairs also feature a rich programme of forums and seminars. The 11th Symposium on Innovation & Technology, jointly organised by HKTDC and the Hong Kong Electronics and Technologies Association, takes place today under the theme "AI-Driven Security & The Next-Gen Infrastructure". Speakers include Alexander Gerfer, Chief Technology Officer of Würth Elektronik Group; Dr Charles Cheung, Adjunct Associate Professor in the Department of Mathematics at Hong Kong Baptist University; and Silvia Ihensekhien, Chief Security Advisor, Greater China at Microsoft. The Symposium on Innovation & Technology, jointly organised by HKTDC and the Hong Kong Electronics and Technologies Association, takes place today under the theme "AI-Driven Security & The Next-Gen Infrastructure" In addition, the Hong Kong Electronic Forum, jointly organised by the HKTDC, MMI Asia Pte Ltd and the Hong Kong Electronic Industries Association, with support from the Electronics Division of The Hong Kong Institution of Engineers, will be held on 15 October under the theme "Future Tech: Powering Electronics Competitiveness with AI and Sustainable Innovation", exploring how AI, sustainability and technological innovation are reshaping the future of the electronics sector. Under the EXHIBITION+ hybrid model, exhibitors and buyers can meet online through the HKTDC Click2Match smart business matching platform in addition to attending the physical fairs. The online exhibitions for the Hong Kong Electronics Fair (Autumn Edition) and electronicAsia run from 6 to 23 October. Photo download: https://bit.ly/4AVhNOu Websites - Hong Kong Electronics Fair (Autumn Edition): https://www.hktdc.com/event/hkelectronicsfairae/en - electronicAsia: https://www.hktdc.com/event/electronicasia/en Media enquiries Please contact the HKTDC’s Communications & Public Affairs Department: Katy Wong Tel: (852) 2584 4524 Email: [email protected] Clayton Lauw Tel: (852) 2584 4472 Email: [email protected] HKTDC Media Room: https://mediaroom.hktdc.com/en About HKTDC The Hong Kong Trade Development Council (HKTDC) celebrates its 60th anniversary this year. The HKTDC is a statutory body established in 1966 to promote, assist and develop Hong Kong's trade. With over 50 offices globally, including 13 in the Chinese Mainland, the HKTDC promotes Hong Kong as a two-way global investment and business hub. The HKTDC organises international exhibitions, conferences and business missions to create business opportunities for companies, particularly small and medium-sized enterprises (SMEs), in the mainland and international markets. The HKTDC also provides up-to-date market insights and product information via trade publications, research reports and digital news channels. For more information, please visit: www.hktdc.com/aboutus.
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