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- IntelIntel Gamer Days 2026 Kicking Off with AAA Gaming Bundle & PartnershipsCompanies: IntelWhat’s New: Intel’s annual Gamer Days campaign officially kicks off today, bringing gamers around the globe exciting new retail promotions, giveaways, and content collaborations with participating partners.Headlining this year’s Intel® Gamer Days campaign is the Intel retail bundle running August 10th through September 13th. With this bundle, gamers can secure their own digital copies of … The post Intel Gamer Days 2026 Kicking Off with AAA Gaming Bundle & Partnerships appeared first on Newsroom.
- IntelIntel Announces Proposed $15 Billion Common Stock OfferingCompanies: IntelIntel Corporation (Nasdaq: INTC) today announced a $15 billion underwritten public offering of common stock.Why NowCustomers continue to signal a strong and sustainable demand environment, driven by unprecedented investment in AI compute. Progress in emerging areas including physical AI, purpose-built silicon, advanced packaging and external wafers represent significant … The post Intel Announces Proposed $15 Billion Common Stock Offering appeared first on Newsroom.
- IntelIntel Announces Leadership Appointment to Strengthen Customer Engagement and Accelerate GrowthCompanies: IntelIntel Corporation today announced the appointment of Dean Jarnac as executive vice president and chief sales officer. Jarnac will lead Intel's global sales organization— strengthening Intel's customer relationships and go-to-market execution across its product portfolio, including client, data center, AI, networking, and ASICs.“Customer focus and execution are central to Intel's strategy and … The post Intel Announces Leadership Appointment to Strengthen Customer Engagement and Accelerate Growth appeared first on Newsroom.
- IntelCreating Pathways to Semiconductor Careers: Intel Launches SEPPCompanies: IntelAs the semiconductor industry continues to drive innovation across nearly every aspect of modern life, Intel is investing in the next generation of talent through the launch of the Semiconductor Education Pathways Program (SEPP) — a comprehensive workforce development initiative designed to strengthen education pathways from K-12 through post-secondary education and into semiconductor careers.SEPP is … The post Creating Pathways to Semiconductor Careers: Intel Launches SEPP appeared first on Newsroom.
- SamsungSamsung Unveils Next-Gen 3D-Memory Vision at FMS 2026, Charting the Future of AI InfrastructureCompanies: Samsung ElectronicsSamsung Electronics a global leader in advanced memory technology, today showcased its latest AI memory innovations at Future of Memory and Storage (FMS) 2026 in Santa Clara, California. With broad expertise spanning DRAM, NAND, enterprise storage and relevant advanced semiconductor technologies, Samsung presented its latest AI memory portfolio and technology roadmap, including a preview of […]
- IntelIntel’s U.S. Advanced Packaging Enables Next-Generation AI SemiconductorsCompanies: IntelAs AI demands unprecedented "brain power," the semiconductor industry is moving past the era of relying on single, massive chips. Advanced packaging is the essential craft of interconnecting multiple specialized chips together. This allows them to function as a single, powerful unit that runs faster handling the massive workloads of the future.Intel’s been doing advanced … The post Intel’s U.S. Advanced Packaging Enables Next-Generation AI Semiconductors appeared first on Newsroom.
- IntelIntel Completes RAMP-C Program, Accelerating Momentum for Secure EnclaveCompanies: IntelWhat’s New: Intel Foundry has completed the Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program. Launched in September 2021, the program supported development of domestic, leading-edge CMOS technology and manufacturing in the United States, establishing a foundation for expanded trusted domestic semiconductor manufacturing.“The collaboration between the DoW and Intel on the Trusted & Assured Microelectronics … The post Intel Completes RAMP-C Program, Accelerating Momentum for Secure Enclave appeared first on Newsroom.
- SamsungSamsung Electronics and Broadcom Expand Strategic Collaboration Across Memory and Foundry TechnologiesCompanies: Samsung ElectronicsBroadcomSamsung Electronics and Broadcom today announced the signing of a memorandum of understanding (MOU) to expand their strategic collaboration across memory and foundry technologies, supporting the next generation of AI infrastructure. The MOU was announced during the AI Summit, held at The Midway in San Francisco. Attendees included Jinman Han, President and Head of Samsung […]
- IntelIntel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI EraCompanies: IntelSANTA CLARA, Calif. & CHANGSHA, China — Intel Corporation and Lens Technology today announced a strategic collaboration focused on enabling new technologies for advanced semiconductor packaging. Through this work, the companies intend to explore opportunities to accelerate the development of glass substrate-based packaging solutions that can help enable higher performance, increased interconnect density, and improved … The post Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era appeared first on Newsroom.
- IntelIntel Reports Second-Quarter 2026 Financial ResultsCompanies: IntelIntel Corporation’s second-quarter 2026 earnings news release and presentation are available on the company’s Investor Relations website. The earnings conference call for investors begins at 2 p.m. PDT today; a public webcast will be available at www.intc.com.More: Earnings News Release | Earnings Call Comments from CEO Lip-Bu Tan and CFO Dave Zinsner The post Intel Reports Second-Quarter 2026 Financial Results appeared first on Newsroom.
- IntelIntel and Fortinet Collaborate to Advance Cybersecurity Innovation and Strengthen Global Supply Chain ResilienceCompanies: IntelFortinetSANTA CLARA AND SUNNYVALE, Calif. – July 21, 2026 – Intel Corporation (NASDAQ: INTC) and Fortinet (NASDAQ: FTNT), today announced a strategic collaboration to develop Fortinet Security Processor 6 (SP6). Expanding a long-standing relationship between the two companies, this collaboration combines Fortinet’s proprietary, purpose-built security processor expertise with Intel’s advanced design, packaging, and manufacturing capabilities … The post Intel and Fortinet Collaborate to Advance Cybersecurity Innovation and Strengthen Global Supply Chain Resilience appeared first on Newsroom.
- AppleApple to increase spend with Broadcom to produce billions more U.S. chipsCompanies: Apple Inc.BroadcomApple announced a new six-year commitment with Broadcom to design and produce custom silicon components and cutting-edge wireless connectivity technologies.