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- COSMOS, Intel, and Airspan to Test and Evaluate OCUDU in End-to-End, 5G/NextG Deployment ScenariosCompanies: IntelPLANO, Texas, August 20, 2026--The Cloud Enhanced Open Software Defined Mobile Wireless Testbed for City-Scale Deployment (COSMOS), a National Science Foundation PAWR (Platform for Advanced Wireless Research) platform led by Rutgers University/WINLAB together with Columbia University and New York University, has embarked on a collaboration with Intel and Airspan Networks to integrate, test, and evaluate the OCUDU (open source CU/DU) software stack in the context of end-to-to open source 5G deplo
- Sivers SemiconductorsInvitation to Presentation of Sivers Semiconductors' Q2 2026 ReportSivers Semiconductors AB (STO: SIVE) will publish its interim report for the second quarter of 2026 on 27 August 2026 at approx. 6:00 PM CET. In connection with the earnings release, a presentation will be held starting at 7:00 PM CET. As Sivers'...
- 海力士在权威期刊发表CPO路线图：不仅“算力之间用光” 还要把光延伸到内存接口格隆汇8月20日｜SK海力士与弗吉尼亚大学等机构的研究人员今日在顶级科学期刊《自然·电子学》联合发表论文，系统阐述了共封装光学(CPO)技术在高性能计算与AI领域的发展路线图。这是SK海力士首次在该级别期刊公开其AI互联架构的技术蓝图。该论文认为，HBM解决了芯片内部的内存瓶颈，但随着AI集群规模扩展至数千块GPU，机架与机架之间的数据传输已成为新的制约——即“带宽墙”。
- proteanTecs®proteanTecs Unveils Advanced Packaging Solutions to Improve Yield, Performance, and Reliability of Multi-Die SystemsHAIFA, Israel, August 19, 2026--proteanTecs®, the leading provider of deep data visibility for advanced electronics, today unveiled a dedicated suite of health, power and performance management solutions for multi-die systems. Based on the company’s unique on-chip monitoring technology, semiconductor and system companies can now improve yield, reduce risk and protect investments in high-value systems-in-package.
- xETFsxETFs Launches ETF to Capture Leading Firms Across the Full Korea AI Semiconductor Ecosystem: KSMHNEW YORK, August 19, 2026--xETFs launches KSMH, provides single-ticker access and exposure to Korea’s largest AI chipmakers and broader Korean semiconductor industry.
- Semtech CorporationSemtech Expands LoRa Plus™ Family: LR2022 and LR2012 Now in ProductionCAMARILLO, Calif., August 19, 2026--Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance semiconductors powering AI data center networking and intelligent, connected Internet of Things ("IoT") devices worldwide, today announced the expansion of its LoRa Plus family with the introduction of the LR2022 and LR2012 transceivers, both now available in production.
- 花旗下调百度美股目标价6.2% AI云基础设施收入放缓削弱业绩百度 营收连续第五个季度下滑，隔夜ADR大跌近13%。花旗表示，公司二季度业绩略低于预期，尽管GPU（图形处理器）营收加速增长，但因AI云基础设施增长缺乏持续性而抵消。 花旗分析师Alicia Yap等人在报告中表示，ADR股价下跌反应了AI云基础设施收入增速放缓、净利润未达预期（因投资资产公允价值下降及汇兑因素）、拟议中的昆仑芯分拆上市时间表缺乏明确的能见度。 鉴于业绩预测调整及下调云业务估值倍数，将百度ADR目标价由177美元下调至166美元。 鉴于估值处于低位以及双重主要上市转换带来的催化剂，维持该股“买入”评级。 花旗表示，预计第三季度公百度通用业务收入将同比下降1.5%；AI驱动的收入将同比增长29%；AI云基础设施收入将同比增长65%至69.4亿元人民币。 海量资讯、精准解读，尽在新浪财经APP 责任编辑：于健 SF069 新浪财经公众号 24小时滚动播报最新的财经资讯和视频，更多粉丝福利扫描二维码关注（sinafi
- HBM像霍尔木兹海峡？投资大佬警告：存储器厂商面临“高价自噬”风险格隆汇8月19日｜科技战略分析师BenThompson从竞争博弈的角度提出犀利的警告：他将存储器厂商比作伊朗，将HBM比作霍尔木兹海峡，“霍尔木兹海峡的威慑力，在于它始终是一张可以打出的牌。一旦真正动用，反而会触发对手彻底绕开它的决心。”他指出，存储器厂商的高价策略正制造连锁反应，一方面，苹果正游说引入中国存储器供应商以打破现有格局；另一方面，算法层面的首要优化方向已变成如何减少存储器使用量。
- Cerebras Unveils CS-4: Up to 30 Times Faster than GPU-based SolutionsCerebras Unveils CS-4: Up to 30 Times Faster than GPU-based Solutions
- IntelIntel Corporation to Participate in Upcoming Investor ConferenceCompanies: IntelIntel Corporation today announced that David Zinsner, executive vice president and chief financial officer, and John Pitzer, corporate vice president, global treasury and investor relations, will participate in a fireside chat on Intel’s business and strategy at the Deutsche Bank's 2026 Technology Conference on August 26 at 10:35 a.m. PDTA live webcast and replay can be accessed publicly on Intel's Investor … The post Intel Corporation to Participate in Upcoming Investor Conference appeared first on Newsroom.
- Intel CorporationIntel Corporation to Participate in Upcoming Investor ConferenceCompanies: IntelSANTA CLARA, Calif., August 18, 2026--Intel Corporation to Participate in Upcoming Investor Conference
- 部分存储芯片现货价格松动下行格隆汇8月18日｜据21财经，今年二季度以来，出现了一个不太寻常的信号——一些存储芯片现货渠道商愿意压低价格出手部分型号的NAND存储芯片。第三方机构闪存市场指出，7月以来多品牌eMMC产品出现持续低价走货现象，现货与合约价形成明显价格倒挂，64GBeMMC现货价格已率先松动下行。eMMC是机顶盒、智能电视、入门级手机等消费电子产品的标配存储芯片。