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  1. Semiconductors美股异动|英特尔涨超7%重回100美元上方,PC用CPU或再提价约10%格隆汇9月8日|英特尔(INTC.US)涨超7%,最高触及103.24美元,创8月17日以来新高。消息面上,供应链人士透露,英特尔PC用CPU预计于10月5日再度提价约10%。这已是英特尔自2025年底以来的第三轮涨价。
  2. FinanceQualcomm Technologies, Inc.Qualcomm Announces Multi-Generational Product Collaboration with Amazon to Build Next-Generation AI Data Center InfrastructureCompanies: QualcommHighlights Qualcomm collaborating with Amazon across multiple generations of customized silicon to support AWS's growing AI infrastructure. Qualcomm advanced optical connectivity solutions will support high-bandwidth interconnects within Amazon data center networks. SAN DIEGO, Sept. 8, 2026 -- Qualcomm Technologies, Inc. (NASDAQ: QCOM) today announced a multi-generation collaboration...
  3. Semiconductors美国银行:ASML高数值孔径技术势头正盛Companies: ASML Holding格隆汇9月8日|美国银行分析师DidierScemama在研究报告中表示,在台积电和三星电子表示计划未来几年大规模采用其高数值孔径技术后,ASMLHolding的先进芯片制造设备势头正盛。Scemama指出,这些公告共同表明该技术正从开发阶段进入逻辑和存储芯片领域的更广泛制造应用。同时,ASML与台积电合作向更大尺寸光掩模转型的公告同样利好,应能提高生产率、降低芯片制造成本并消除拼接限制。
  4. AI江波龙港股上市首日平开 AI供应链企业赴港上市热度面临考验深圳市江波龙电子股份有限公司周二在香港上市,首日开盘基本持平。该公司此前通过发售股份募集70.8亿港元(约9.03亿美元)。在中国人工智能供应链企业的赴港上市热潮中,江波龙的股价表现将考验投资者的热情是否仍具韧性。 江波龙开盘表现基本与其每股236港元的发行价持平。知情人士此前表示,作为全球最大的独立存储模组制造商之一,江波龙在悉数行使15%的发售量调整权后,共发售约3000万股股份。该公司将发行价定为每股236港元,低于240.60港元的最高指导价,也较其深圳上市股票此前收盘价折让44%。该公司自2022年已在深圳上市。 尽管受供应趋紧推动,DRAM和NAND价格今年大幅上涨,但市场仍将通过江波龙上市后的表现,观察投资者对于波快速变化的存储器价格前景以及AI基础设施建设热潮可持续性的看法。 香港新股市场今年已筹集逾450亿美元资金,2026年已然成为有记录以来融资规模第三高的年份。彭博汇编数据显示,在规模与江波龙相当或更大的1
  5. SemiconductorsASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUVCompanies: TSMCASML HoldingASML and TSMC Announce Initiative to Pioneer Industry Transition to Large-Format Photomasks for High NA EUV
  6. FinanceCrealights and GlobalFoundries Deepen Global Strategic PartnershipHONGKONG/BEIJING, Sept 8, 2026 - September 7, 2026, Crealights (01191.HK) today officially announced a landmark partnership, establishing a long-term, in-depth strategic collaboration with GlobalFoundries (NASDAQ: GFS, "GF"), a leading global semiconductor manufacturer. Leveraging GF's industry-leading silicon photonics technology, Crealights will vigorously advance the engineering deployment and mass production of its 6.4T NPO (Near-Package Optics) products, accelerating the industrialization of next-generation AI silicon photonic interconnect technologies. This strategic move will empower Crealights to consolidate its domestic market position while continuously expanding its footprint in North America and its global business landscape, marking a new phase in the company's global commercialization journey. Currently, global AI computing clusters are rapidly evolving from horizontal scaling (Scale-out) to vertical scaling (Scale-up). Facing the extreme demands of 10,000-card-scale hyperscale data centers for bandwidth density, power efficiency, and latency, Near-Package Optics (NPO) and Co-Packaged Optics (CPO) have emerged as mainstream solutions to overcome next-generation AI interconnect bottlenecks. By integrating and packaging the optical engine directly adjacent to the compute chip, these technologies significantly shorten the optoelectronic signal transmission path. Backed by its comprehensive and mature full-stack silicon photonic technology moat in both NPO and CPO, Crealights has taken the lead in launching 3.2T and 6.4T NPO optical engine products, demonstrating a robust technological advantage in next-generation high-speed AI interconnects. To comprehensively solidify the technological foundation for high-density optical interconnects in next-generation AI systems, Crealights has entered into a deep partnership with GlobalFoundries (GF). By deeply integrating GF's silicon photonics platform with SCALE™ Co-Packaged Optics (CPO) solutions, Crealights continues to build a comprehensive advantage integrating photonic integration, high-performance RF CMOS, advanced optical devices, and fiber optic connectivity. Currently, Crealights is collaborating with GF to establish a broad ecosystem of partners spanning design, packaging, connectivity, and system layers, fully supporting the deployment and implementation of diverse next-generation optical architectures. Meanwhile, leveraging GF’s scalable global manufacturing footprint and proven high-volume production capabilities, Crealights has established a "dual-track" global manufacturing system that operates in parallel both domestically and internationally. Through the efficient synergy of capacity at home and abroad, this strong alliance has not only significantly shortened the R&D cycle for next-generation optical interconnect products, but also achieved end-to-end integration across the entire chain—from local chip design to scaled delivery for customers in North America and worldwide. Together, they are paving a clear path from technology development to large-scale commercialization, effectively addressing the increasingly urgent demand for optical connectivity in AI computing clusters and hyperscale data centers. A spokesperson for Crealights stated: "Having consolidated our position in the domestic AI computing infrastructure market, Crealights is now driving its global expansion with core NPO and CPO technologies. Adding GF's global manufacturing network and silicon photonics process technology to our current silicon photonics ecosystem ensures a stable supply of next-generation silicon photonic products and completes the commercial closed-loop from local R&D to global delivery, continuously providing core interconnect solutions for large-scale AI computing clusters worldwide." Thomas Barber, Vice President of Communications Infrastructure and Data Center End Markets at GlobalFoundries, commented: "Crealights' comprehensive full-stack silicon photonic design capabilities are highly aligned with GF's strengths in scaled wafer manufacturing. Through global capacity synergy and advanced packaging technology empowerment, both parties will drive the large-scale market deployment of Crealights' products in North America and globally, jointly promoting the widespread application of silicon photonic technology in global AI computing infrastructure." Looking ahead, Crealights will continue to deepen their collaboration with GF across three key areas: joint R&D of cutting-edge technologies, global manufacturing capacity synergy, and the industrialization of NPO and CPO, as well as the co-building of the industry ecosystem. This will drive the global scaled deployment of silicon photonic solutions, unlocking more technological possibilities for AI-driven diverse application scenarios. About Crealights Crealights is a globally leading provider of AI silicon photonic interconnect solutions, dedicated to delivering high-speed, low-power optical interconnect products for AI data centers and hyperscale computing clusters. The company possesses end-to-end technical capabilities spanning silicon photonic chip design, wafer testing, and optical module manufacturing. Its core product portfolio covers 400G, 800G and 1.6T optical modules, Active Optical Cables (AOC), as well as NPO and CPO optical engines. Backed by its deep domestic industry foundation and global capacity layout, Crealights has become a key player in global AI computing interconnects.For more information, visit www.crealights.com. About GlobalFoundries GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for automotive, aerospace and defense, data center, smart mobile devices, internet of things and other high-growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity and sustainability. For more information, please follow the WeChat Official Account: GLOBALFOUNDRIES_CN. Media Contact Ms. Claire ZhangTEL: (852) 5427 3696E-mail: [email protected]
  7. FinanceAutolivAutoliv Advances Vehicle Safety Through Virtual TestingAutoliv, Inc. (NYSE: ALV) (SSE: ALIVsdb), the worldwide leader in automotive safety systems, is advancing the development of virtual testing through its Human Body Model (HBM) Safety Suite. The platform is designed to support the development of...
  8. Finance海光芯正攜手格羅方德深化全球戰略合作香港/北京, 2026年9月8日 - 2026年9月7日,海光芯正(01191.HK)今日官宣重磅合作,與全球領先半導體製造商格羅方德(GlobalFoundries,NASDAQ:GFS,下稱「GF」)建立長期深度戰略合作關係。公司將依託格羅方德(GF)業界領先的硅光子技術,全力推進6.4T NPO產品的工程落地與規模化量產,加速下一代AI硅光互連技術產業化進程。此次合作將助力海光芯正穩固中國本土市場,并加速拓寬北美市場與全球業務版圖,標誌著公司全球化商業進程邁入全新發展階段。 當前,全球AI算力集群正從橫向擴展(Scale-out)向縱向擴展(Scale-up)加速演進。面對萬卡級超大規模數據中心對帶寬密度、傳輸功耗及延遲的極致要求,NPO(近封裝光學)與CPO(共封裝光學)技術通過將光引擎緊貼計算芯片集成封裝,大幅縮短光電信號傳輸鏈路,已成為突破下一代AI互連瓶頸的主流解決方案。海光芯正憑借在NPO、CP
  9. Finance海光芯正攜手格羅方德深化全球戰略合作香港/北京, 2026年9月8日 - 2026年9月7日,海光芯正(01191.HK)今日官宣重磅合作,與全球領先半導體製造商格羅方德(GlobalFoundries,NASDAQ:GFS,下稱「GF」)建立長期深度戰略合作關係。公司將依託格羅方德(GF)業界領先的硅光子技術,全力推進6.4T NPO產品的工程落地與規模化量產,加速下一代AI硅光互連技術產業化進程。此次合作將助力海光芯正穩固中國本土市場,并加速拓寬北美市場與全球業務版圖,標誌著公司全球化商業進程邁入全新發展階段。 當前,全球AI算力集群正從橫向擴展(Scale-out)向縱向擴展(Scale-up)加速演進。面對萬卡級超大規模數據中心對帶寬密度、傳輸功耗及延遲的極致要求,NPO(近封裝光學)與CPO(共封裝光學)技術通過將光引擎緊貼計算芯片集成封裝,大幅縮短光電信號傳輸鏈路,已成為突破下一代AI互連瓶頸的主流解決方案。海光芯正憑借在NPO、CPO領域完整且成熟的全棧式硅光技術壁壘,已率先推出3.2T及6.4T NPO產品,在下一代AI高速互連領域展現出強勁的技術領先優勢。 為全面夯實面向下一代AI系統的高密度光互連技術根基,海光芯正深度攜手格羅方德(GF),透過深度融合GF的硅光子平台與SCALE™共封裝光學(CPO)解決方案,持續構建光子集成、高性能射頻CMOS、先進光器件及光纖連接方案融為一體的綜合優勢。目前,海光芯正正協同格羅方德(GF)建立涵蓋設計、封裝、連接及系統層面的廣泛生態夥伴,全面支持下一代各類光架構的部署落地。 與此同時,海光芯正依託GF可擴展的全球化製造佈局與成熟的大規模量產能力,構建起「國內外雙軌並行」的全球化製造體系。透過海內外產能的高效協同,公司將大幅縮短新一代光互連產品的研發週期,實現從本土芯片設計到面向北美及全球客戶規模化交付的端到端全鏈路協同,為響應AI算力集群與超大規模數據中心日益迫切的光連接需求,打通了從技術研發到規模化商用的清晰路徑。 海光芯正發言人表示:「在夯實國內AI算力基礎設施市場地位的基礎上,海光芯正正以核心的NPO和CPO技術為引擎,全面提速全球化戰略部署。通過將GF成熟的全球製造網絡與硅光子工藝技術深度融入現有的硅光生態系統,我們不僅築牢了下一代硅光產品的穩定供應基石,更徹底打通了從本土研發到全球交付的商業閉環,從而持續為全球大規模AI算力集群輸送核心的互連解決方案。」 格羅方德通信基礎設施與數據中心終端市場副總裁 Thomas Barber 表示:「海光芯正完備的硅光全棧設計能力,與GF規模化晶圓製造優勢高度匹配。雙方將依託全球產能協同與先進封裝技術賦能,推動海光芯正產品在北美及全球市場規模落地,共同促進硅光子技術在全球AI算力基礎設施中的廣泛應用。」 未來,海光芯正將持續圍繞前沿技術聯合研發、全球製造產能協同、NPO與CPO產業化及產業生態共建三大方向持續與格羅方德(GF)開展深度協同合作,推動引領硅光子解決方案全球規模化落地,為AI驅動的多元應用場景釋放無限可能。 關於海光芯正 海光芯正是全球領先的AI硅光互連解決方案提供商,專注於為AI數據中心與超大規模算力集群提供高速、低功耗的光互連產品。公司具備從硅光芯片設計、晶圓測試到光模塊製造的全鏈條技術能力,核心產品覆蓋400G、800G、1.6T光模塊、AOC及NPO、CPO等。依託本土深厚的產業根基與全球化產能佈局,海光芯正已成為全球AI算力互聯的重要參與者。欲瞭解更多信息,請訪問 http://www.crealights.com 關於格羅方德 格羅方德(GF)是全球領先的基礎半導體製造商,致力於推動人工智能(AI)從雲端到物理世界的規模化應用。依託與客戶的深度戰略合作,格羅方德(GF)為汽車、航空航天與國防、數據中心、智能移動設備、物聯網及其他高增長市場,提供具備差異化優勢、高能效且高性能的解決方案。憑借橫跨美國、歐洲和亞洲的全球化製造佈局,GF 已成為全球客戶值得信賴的全方位技術合作夥伴。格羅方德(GF)卓越的全球化團隊,始終將安全、長效與可持續發展作為每日運營的核心准則。欲瞭解更多信息,請關注微信公眾號GLOBALFOUNDRIES_CN。 如有垂詢,請聯絡: 張緣/ Ms. Claire Zhang 直線:(852) 5427 3696 電郵:[email protected]
  10. FinanceCrealights and GlobalFoundries Deepen Global Strategic PartnershipHONGKONG/BEIJING, Sept 8, 2026 - September 7, 2026, Crealights (01191.HK) today officially announced a landmark partnership, establishing a long-term, in-depth strategic collaboration with GlobalFoundries (NASDAQ: GFS, "GF"), a leading global semiconductor manufacturer. Leveraging GF's industry-leading silicon photonics technology, Crealights will vigorously advance the engineering deployment and mass production of its 6.4T NPO (Near-Package Optics) products, accelerating the industrialization of next-generation AI silicon photonic interconnect technologies. This strategic move will empower Crealights to consolidate its domestic market position while continuously expanding its footprint in North America and its global business landscape, marking a new phase in the company's global commercialization journey. Currently, global AI computing clusters are rapidly evolving from horizontal scaling (Scale-out) to vertical scaling (Scale-up). Facing the extreme demands of 10,000-card-scale hyperscale data centers for bandwidth density, power efficiency, and latency, Near-Package Optics (NPO) and Co-Packaged Optics (CPO) have emerged as mainstream solutions to overcome next-generation AI interconnect bottlenecks. By integrating and packaging the optical engine directly adjacent to the compute chip, these technologies significantly shorten the optoelectronic signal transmission path. Backed by its comprehensive and mature full-stack silicon photonic technology moat in both NPO and CPO, Crealights has taken the lead in launching 3.2T and 6.4T NPO optical engine products, demonstrating a robust technological advantage in next-generation high-speed AI interconnects. To comprehensively solidify the technological foundation for high-density optical interconnects in next-generation AI systems, Crealights has entered into a deep partnership with GlobalFoundries (GF). By deeply integrating GF's silicon photonics platform with SCALE™ Co-Packaged Optics (CPO) solutions, Crealights continues to build a comprehensive advantage integrating photonic integration, high-performance RF CMOS, advanced optical devices, and fiber optic connectivity. Currently, Crealights is collaborating with GF to establish a broad ecosystem of partners spanning design, packaging, connectivity, and system layers, fully supporting the deployment and implementation of diverse next-generation optical architectures. Meanwhile, leveraging GF’s scalable global manufacturing footprint and proven high-volume production capabilities, Crealights has established a "dual-track" global manufacturing system that operates in parallel both domestically and internationally. Through the efficient synergy of capacity at home and abroad, this strong alliance has not only significantly shortened the R&D cycle for next-generation optical interconnect products, but also achieved end-to-end integration across the entire chain—from local chip design to scaled delivery for customers in North America and worldwide. Together, they are paving a clear path from technology development to large-scale commercialization, effectively addressing the increasingly urgent demand for optical connectivity in AI computing clusters and hyperscale data centers. A spokesperson for Crealights stated: "Having consolidated our position in the domestic AI computing infrastructure market, Crealights is now driving its global expansion with core NPO and CPO technologies. Adding GF's global manufacturing network and silicon photonics process technology to our current silicon photonics ecosystem ensures a stable supply of next-generation silicon photonic products and completes the commercial closed-loop from local R&D to global delivery, continuously providing core interconnect solutions for large-scale AI computing clusters worldwide." Thomas Barber, Vice President of Communications Infrastructure and Data Center End Markets at GlobalFoundries, commented: "Crealights' comprehensive full-stack silicon photonic design capabilities are highly aligned with GF's strengths in scaled wafer manufacturing. Through global capacity synergy and advanced packaging technology empowerment, both parties will drive the large-scale market deployment of Crealights' products in North America and globally, jointly promoting the widespread application of silicon photonic technology in global AI computing infrastructure." Looking ahead, Crealights will continue to deepen their collaboration with GF across three key areas: joint R&D of cutting-edge technologies, global manufacturing capacity synergy, and the industrialization of NPO and CPO, as well as the co-building of the industry ecosystem. This will drive the global scaled deployment of silicon photonic solutions, unlocking more technological possibilities for AI-driven diverse application scenarios. About Crealights Crealights is a globally leading provider of AI silicon photonic interconnect solutions, dedicated to delivering high-speed, low-power optical interconnect products for AI data centers and hyperscale computing clusters. The company possesses end-to-end technical capabilities spanning silicon photonic chip design, wafer testing, and optical module manufacturing. Its core product portfolio covers 400G, 800G and 1.6T optical modules, Active Optical Cables (AOC), as well as NPO and CPO optical engines. Backed by its deep domestic industry foundation and global capacity layout, Crealights has become a key player in global AI computing interconnects.For more information, visit www.crealights.com. About GlobalFoundries GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for automotive, aerospace and defense, data center, smart mobile devices, internet of things and other high-growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity and sustainability. For more information, please follow the WeChat Official Account: GLOBALFOUNDRIES_CN. Media Contact Ms. Claire Zhang TEL: (852) 5427 3696 E-mail: [email protected]
  11. Finance海光芯正攜手格羅方德深化全球戰略合作2026年9月7日,海光芯正(01191.HK)今日官宣重磅合作,與全球領先半導體製造商格羅方德(GlobalFoundries,NASDAQ:GFS,下稱「GF」)建立長期深度戰略合作關係。
  12. SemiconductorsASML reports transactions under its current share buyback programCompanies: ASML HoldingASML reports transactions under its current share buyback program