Browse press releases
The newest releases come first, each with its full text here and a link to its original. Try the filters to narrow them down.
- Cleanroom Lighting Market 2026: Pharma, Biotech and Semiconductor Expansion Fuels New Growth OpportunitiesLED upgrades, smart IoT controls and recessed fixtures offer opportunities as pharma, biotech and chipmaking expand cleanrooms, led by Asia-Pacific and stricter compliance.
- 大行评级丨花旗：AI持续学习料推动2027年eSSD需求急升，重申三星电子及SK海力士“买入”评级Companies: Samsung ElectronicsSK Hynix花旗发表报告指，持续学习与AI推理将推动eSSD(企业级SSD)芯片需求大幅增加，该行预测明年将同比增长52.9%，整体SSD需求料升45%。该行预期QLC需求将显著上升，主要受到近GPU储存采用增加，以及中国AI数据中心需求上升所带动。该行认为强劲的企业AI需求应可抵销较疲弱的消费性NAND需求。
- 大行评级丨里昂：看好韩国半导体于Agentic AI供应链关键地位，予SK海力士“高度确信跑赢大市”评级Companies: SK Hynix里昂发表研报指，代理式AI将大型AI模型的单次推理，转变为每次任务需运行多轮的长期工具使用循环，对存储器容量、频宽及机架规模完整性构成压力，远超单纯运算问题，因而需要高频宽存储器(HBM)、低功耗双倍数据率(LPDDR)/小型压缩附加存储器模块(SOCAMM)、企业级固态硬盘(eSSD)/高频宽快闪存储器(HBF)、先进封装、测试及前端微缩等配合。该行指，韩国在AI存储器、键合、基板、测试及前端处...
- China Telecom AI Officially Releases Xing4.0-29B Agentic Large Model for Single-GPU DeploymentCompanies: China TelecomCompact footprint, full-scale capability—China's lightweight agentic large model runs locally on consumer-grade hardware while also powering enterprise production systems
- 龙芯自研通用GPU加速计算平台首个软件版本面世格隆汇9月22日｜龙芯中科近日正式发布支持自研通用GPU的龙芯加速计算平台(LoongsonAcceleratedComputingPlatform)首个软件版本，构筑起面向智能应用时代的完整算力软件产品体系。
- The Global Semiconductor Market Accelerates as AI Computing, Advanced Nodes and Automotive Electronics Reshape Global Chip DemandThe Global Semiconductor Industry Size, Share, Growth, Revenue Trends & Segmentation Analysis by Component, Application, and Forecast 2026-2035.
- Qnity Electronics, Inc.Qnity Joins PHLX Semiconductor Sector Index (SOX)Companies: QnityWILMINGTON, Del., September 21, 2026--Qnity Electronics, Inc. ("Qnity") (NYSE: Q), a premier technology solutions leader across the semiconductor value chain, today announced that it has been added to the PHLX Semiconductor Sector Index (SOX).
- Tensormesh Heads to The AI Conference 2026 With a Solution for Redundant GPU ComputeSAN FRANCISCO, September 21, 2026--Tensormesh, the company pioneering caching-accelerated inference optimization for enterprise AI, will exhibit at The AI Conference 2026, Sept. 30 through Oct. 1 at Pier 48 in San Francisco.
- 美芯片股集体上涨 AMD加入万亿美元市值行列格隆汇9月21日｜受人工智能需求持续增长带动，美股时段芯片股普遍上涨，AMD(AMD.O)股价盘中涨超9%，一度升至历史新高613.92美元，推动公司市值突破1万亿美元。AMD被视为人工智能领域龙头英伟达(NVDA.O)在图形处理器（GPU）市场的最主要竞争对手之一。AMD成为第四家市值突破1万亿美元的美国芯片制造商，此前达到这一规模的企业包括英伟达、博通(AVGO.O)和美光科技(MU.O)。
- Axcelis Technologies, Inc.Axcelis Announces Sponsorship and Participation in the 23rd International Conference on Silicon Carbide and Related Materials (ICSCRM 2026)Axcelis Technologies, Inc. (NASDAQ: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, will be participating in the 23rd International Conference on Silicon Carbide and Related Materials (ICSCRM...
- ASML reports transactions under its current share buyback programCompanies: ASML HoldingASML reports transactions under its current share buyback program
- fJscaler Announces Sampling of Breakthrough 100 GHz BiCMOS TIA for Next-Generation AI and Cloud Datacenter Optical InterconnectsMÁLAGA, Spain, September 21, 2026--fJscaler, Inc., an innovator in high-performance analog and photonic semiconductors for optical interconnects, today announced at ECOC 2026 that it has begun sampling to strategic customers its BiCMOS transimpedance amplifier (TIA) for intensity-modulation direct-detection (IM-DD) applications. Designed for next-generation optical interconnects powering AI and cloud datacenters, the device delivers an unprecedented combination of energy efficiency, sensitivity,