Browse press releases

The newest releases come first, each with its full text here and a link to its original. Try the filters to narrow them down.

230 resultsPage 13 of 20, newest first
  1. TelecomDas REDMI Note 17 Pro Max 5G erscheint mit einem 9.210-mAh-Akku, der auf Langlebigkeit ausgelegt istDie REDMI Note Series, von der bereits über 500 Millionen Geräte in mehr als 100 Märkten ausgeliefert wurden, bietet nun beim Pro Max-Modell den leistungsstärksten Akku aller Zeiten: 9.210 mAh, bis zu 3 Tage Betriebsdauer mit einer einzigen Ladung und eine Akkulebensdauer von bis zu 6...
  2. EducationHuawei Technologies Co., LtdClosing Digital Literacy Gap Could Unlock Trillions of Dollars in Global GDP GrowthNew report, authored by GSMA Intelligence in partnership with Huawei, released at UNESCO's Digital Learning Week — More than one in three (38%) people remains offline despite being covered by mobile broadband – and a lack of digital literacy skills is...
  3. Telecom机构:因人工智能热潮抵消伊朗冲突担忧 日经指数回升格隆汇9月9日|周三,随着市场对中东局势升级的担忧被人工智能热潮所取代,日本股市回升。日经225指数最新上涨0.35%,此前一度下跌,更广泛的东证指数则上涨约0.24%。野村证券股票策略师MakiSawada表示,Verizon与康宁签署一项价值数十亿美元的协议,为人工智能基础设施提供高密度光纤的消息,提振了富士通等日本电缆制造商的信心。
  4. SaaSClearwave FiberClearwave and Visionary Broadband Sign Agreement to Combine, Expanding Fiber Platform to 17 StatesCombination unites two fiber-first, independently owned providers, reaching approximately 700,000 homes and businesses across the Southeast, Midwest, and Western U.S.
  5. Telecom6G 手机加速:我国计划 2030 年全面建成性能领先的新一代通信网IT之家 9 月 8 日消息,据央视新闻报道,工信部昨日发布《信息通信行业发展“十五五”规划》。《规划》提出,预计到 2030 年,全面建成覆盖完善、性能领先的新一代通信网,为到 2035 年基本实现信息通信行业现代化奠定坚实基础。 《规划》集中列出了涵盖信息通信行业总体发展、创新发展、绿色发展、基础设施、应用普及 5 个方面的多个主要指标。其中包括,到 2030 年,信息通信行业收入达到 4.1 万亿元、每万人拥有 5G(含 5G-A)基站数 50 个、5G(含 5G-A)用户普及率达到 95%、千兆以上宽带用户数达到 3.2 亿户、智能算力规模达到每秒 9800 百亿亿次浮点运算等。 IT之家注意到,《规划》还提出,推动卫星网络与地面通信网络深度融合,统筹建设星地互联中心,开展手机直连卫星、卫星物联网等应用。研制 6G 基站、6G 智能手机,强化光通信、算力网络、量子通信等信息通信重点领域标准体系建设。 新浪科技公众号 “掌
  6. Telecom有序部署万卡、十万卡及以上智算集群 适时启动6G商用【相关阅读】 “光”又回来了!CPO飙涨,通信ETF集体爆发,谁是“真龙头”? CPO设备,缺货潮蔓延 9月7日,工业和信息化部发布《信息通信行业发展“十五五”规划》(以下简称《规划》)。 《规划》明确提出,到2030年,全面建成覆盖完善、性能领先的新一代通信网,加快形成技术先进、安全可控的信息通信产业体系,有效构建技管结合、敏捷高效的信息通信行业治理体系,打造全域联动、实战实用的网络和数据安全保障能力,行业赋能水平与全球化发展水平进一步提升,信息通信行业现代化迈出坚实步伐,为到2035年基本实现信息通信行业现代化奠定坚实基础。 《每日经济新闻》记者注意到,《规划》以表格形式集中列出了13个主要指标,涵盖总体发展、创新发展、绿色发展、基础设施、应用普及5个方面,充分体现量的合理增长和质的有效提升。《规划》明确:“十五五”时期,将在信息基础设施领域5年累计投资3.8万亿元。 构建“枢纽—区域—边缘”多层次算力设施体系 《规划》共提
  7. FinanceCrealights and GlobalFoundries Deepen Global Strategic PartnershipHONGKONG/BEIJING, Sept 8, 2026 - September 7, 2026, Crealights (01191.HK) today officially announced a landmark partnership, establishing a long-term, in-depth strategic collaboration with GlobalFoundries (NASDAQ: GFS, "GF"), a leading global semiconductor manufacturer. Leveraging GF's industry-leading silicon photonics technology, Crealights will vigorously advance the engineering deployment and mass production of its 6.4T NPO (Near-Package Optics) products, accelerating the industrialization of next-generation AI silicon photonic interconnect technologies. This strategic move will empower Crealights to consolidate its domestic market position while continuously expanding its footprint in North America and its global business landscape, marking a new phase in the company's global commercialization journey. Currently, global AI computing clusters are rapidly evolving from horizontal scaling (Scale-out) to vertical scaling (Scale-up). Facing the extreme demands of 10,000-card-scale hyperscale data centers for bandwidth density, power efficiency, and latency, Near-Package Optics (NPO) and Co-Packaged Optics (CPO) have emerged as mainstream solutions to overcome next-generation AI interconnect bottlenecks. By integrating and packaging the optical engine directly adjacent to the compute chip, these technologies significantly shorten the optoelectronic signal transmission path. Backed by its comprehensive and mature full-stack silicon photonic technology moat in both NPO and CPO, Crealights has taken the lead in launching 3.2T and 6.4T NPO optical engine products, demonstrating a robust technological advantage in next-generation high-speed AI interconnects. To comprehensively solidify the technological foundation for high-density optical interconnects in next-generation AI systems, Crealights has entered into a deep partnership with GlobalFoundries (GF). By deeply integrating GF's silicon photonics platform with SCALE™ Co-Packaged Optics (CPO) solutions, Crealights continues to build a comprehensive advantage integrating photonic integration, high-performance RF CMOS, advanced optical devices, and fiber optic connectivity. Currently, Crealights is collaborating with GF to establish a broad ecosystem of partners spanning design, packaging, connectivity, and system layers, fully supporting the deployment and implementation of diverse next-generation optical architectures. Meanwhile, leveraging GF’s scalable global manufacturing footprint and proven high-volume production capabilities, Crealights has established a "dual-track" global manufacturing system that operates in parallel both domestically and internationally. Through the efficient synergy of capacity at home and abroad, this strong alliance has not only significantly shortened the R&D cycle for next-generation optical interconnect products, but also achieved end-to-end integration across the entire chain—from local chip design to scaled delivery for customers in North America and worldwide. Together, they are paving a clear path from technology development to large-scale commercialization, effectively addressing the increasingly urgent demand for optical connectivity in AI computing clusters and hyperscale data centers. A spokesperson for Crealights stated: "Having consolidated our position in the domestic AI computing infrastructure market, Crealights is now driving its global expansion with core NPO and CPO technologies. Adding GF's global manufacturing network and silicon photonics process technology to our current silicon photonics ecosystem ensures a stable supply of next-generation silicon photonic products and completes the commercial closed-loop from local R&D to global delivery, continuously providing core interconnect solutions for large-scale AI computing clusters worldwide." Thomas Barber, Vice President of Communications Infrastructure and Data Center End Markets at GlobalFoundries, commented: "Crealights' comprehensive full-stack silicon photonic design capabilities are highly aligned with GF's strengths in scaled wafer manufacturing. Through global capacity synergy and advanced packaging technology empowerment, both parties will drive the large-scale market deployment of Crealights' products in North America and globally, jointly promoting the widespread application of silicon photonic technology in global AI computing infrastructure." Looking ahead, Crealights will continue to deepen their collaboration with GF across three key areas: joint R&D of cutting-edge technologies, global manufacturing capacity synergy, and the industrialization of NPO and CPO, as well as the co-building of the industry ecosystem. This will drive the global scaled deployment of silicon photonic solutions, unlocking more technological possibilities for AI-driven diverse application scenarios. About Crealights Crealights is a globally leading provider of AI silicon photonic interconnect solutions, dedicated to delivering high-speed, low-power optical interconnect products for AI data centers and hyperscale computing clusters. The company possesses end-to-end technical capabilities spanning silicon photonic chip design, wafer testing, and optical module manufacturing. Its core product portfolio covers 400G, 800G and 1.6T optical modules, Active Optical Cables (AOC), as well as NPO and CPO optical engines. Backed by its deep domestic industry foundation and global capacity layout, Crealights has become a key player in global AI computing interconnects.For more information, visit www.crealights.com. About GlobalFoundries GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for automotive, aerospace and defense, data center, smart mobile devices, internet of things and other high-growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity and sustainability. For more information, please follow the WeChat Official Account: GLOBALFOUNDRIES_CN. Media Contact Ms. Claire ZhangTEL: (852) 5427 3696E-mail: [email protected]
  8. FinanceCrealights and GlobalFoundries Deepen Global Strategic PartnershipHONGKONG/BEIJING, Sept 8, 2026 - September 7, 2026, Crealights (01191.HK) today officially announced a landmark partnership, establishing a long-term, in-depth strategic collaboration with GlobalFoundries (NASDAQ: GFS, "GF"), a leading global semiconductor manufacturer. Leveraging GF's industry-leading silicon photonics technology, Crealights will vigorously advance the engineering deployment and mass production of its 6.4T NPO (Near-Package Optics) products, accelerating the industrialization of next-generation AI silicon photonic interconnect technologies. This strategic move will empower Crealights to consolidate its domestic market position while continuously expanding its footprint in North America and its global business landscape, marking a new phase in the company's global commercialization journey. Currently, global AI computing clusters are rapidly evolving from horizontal scaling (Scale-out) to vertical scaling (Scale-up). Facing the extreme demands of 10,000-card-scale hyperscale data centers for bandwidth density, power efficiency, and latency, Near-Package Optics (NPO) and Co-Packaged Optics (CPO) have emerged as mainstream solutions to overcome next-generation AI interconnect bottlenecks. By integrating and packaging the optical engine directly adjacent to the compute chip, these technologies significantly shorten the optoelectronic signal transmission path. Backed by its comprehensive and mature full-stack silicon photonic technology moat in both NPO and CPO, Crealights has taken the lead in launching 3.2T and 6.4T NPO optical engine products, demonstrating a robust technological advantage in next-generation high-speed AI interconnects. To comprehensively solidify the technological foundation for high-density optical interconnects in next-generation AI systems, Crealights has entered into a deep partnership with GlobalFoundries (GF). By deeply integrating GF's silicon photonics platform with SCALE™ Co-Packaged Optics (CPO) solutions, Crealights continues to build a comprehensive advantage integrating photonic integration, high-performance RF CMOS, advanced optical devices, and fiber optic connectivity. Currently, Crealights is collaborating with GF to establish a broad ecosystem of partners spanning design, packaging, connectivity, and system layers, fully supporting the deployment and implementation of diverse next-generation optical architectures. Meanwhile, leveraging GF’s scalable global manufacturing footprint and proven high-volume production capabilities, Crealights has established a "dual-track" global manufacturing system that operates in parallel both domestically and internationally. Through the efficient synergy of capacity at home and abroad, this strong alliance has not only significantly shortened the R&D cycle for next-generation optical interconnect products, but also achieved end-to-end integration across the entire chain—from local chip design to scaled delivery for customers in North America and worldwide. Together, they are paving a clear path from technology development to large-scale commercialization, effectively addressing the increasingly urgent demand for optical connectivity in AI computing clusters and hyperscale data centers. A spokesperson for Crealights stated: "Having consolidated our position in the domestic AI computing infrastructure market, Crealights is now driving its global expansion with core NPO and CPO technologies. Adding GF's global manufacturing network and silicon photonics process technology to our current silicon photonics ecosystem ensures a stable supply of next-generation silicon photonic products and completes the commercial closed-loop from local R&D to global delivery, continuously providing core interconnect solutions for large-scale AI computing clusters worldwide." Thomas Barber, Vice President of Communications Infrastructure and Data Center End Markets at GlobalFoundries, commented: "Crealights' comprehensive full-stack silicon photonic design capabilities are highly aligned with GF's strengths in scaled wafer manufacturing. Through global capacity synergy and advanced packaging technology empowerment, both parties will drive the large-scale market deployment of Crealights' products in North America and globally, jointly promoting the widespread application of silicon photonic technology in global AI computing infrastructure." Looking ahead, Crealights will continue to deepen their collaboration with GF across three key areas: joint R&D of cutting-edge technologies, global manufacturing capacity synergy, and the industrialization of NPO and CPO, as well as the co-building of the industry ecosystem. This will drive the global scaled deployment of silicon photonic solutions, unlocking more technological possibilities for AI-driven diverse application scenarios. About Crealights Crealights is a globally leading provider of AI silicon photonic interconnect solutions, dedicated to delivering high-speed, low-power optical interconnect products for AI data centers and hyperscale computing clusters. The company possesses end-to-end technical capabilities spanning silicon photonic chip design, wafer testing, and optical module manufacturing. Its core product portfolio covers 400G, 800G and 1.6T optical modules, Active Optical Cables (AOC), as well as NPO and CPO optical engines. Backed by its deep domestic industry foundation and global capacity layout, Crealights has become a key player in global AI computing interconnects.For more information, visit www.crealights.com. About GlobalFoundries GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for automotive, aerospace and defense, data center, smart mobile devices, internet of things and other high-growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity and sustainability. For more information, please follow the WeChat Official Account: GLOBALFOUNDRIES_CN. Media Contact Ms. Claire Zhang TEL: (852) 5427 3696 E-mail: [email protected]
  9. AIKaltura to Showcase AI-Powered Media and Telecom Innovations at IBC 2026, Spanning Customer Care Avatars, Sports Discovery, and Personalized Streaming ExperiencesCompany debuts new AI capabilities for content discovery, customer engagement, accessibility, and monetization, alongside its broader AI-powered Cloud TV platform
  10. FinanceCrealights Officially Included in Stock Connect, A New Capital Market Milestone for the AI Silicon Photonics Interconnect PioneerHONG KONG, Sept 7, 2026 - Crealights Technology Co., Ltd. (“Crealights” or the “Company”, Stock Code: 1191.HK) has been officially included as a constituent stock of the Hang Seng Composite Index, becoming eligible for the Stock Connect trading scheme starting today. Mainland investors can now trade the Company’s shares directly through the Stock Connect channels, which is expected to further broaden the Company’s investor base and enhance its share trading liquidity. This inclusion follows the Hang Seng Index Company's quarterly review results for the period ended June 30, 2026, announced on August 21, 2026. The inclusion deepens the Company’s connection with the onshore capital market, which is expected to attract greater long-term capital interest and provide more diversified capital market support for the Company’s long-term value growth. Continuous Financial Deliverables and Accelerated Product Structure Upgrades The Company released its post-listing interim results on August 28. During the reporting period, total revenue reached RMB798.5 million, representing a year-on-year increase of 14.4% and a half-on-half growth of 52.7%. The revenue contribution from silicon photonics products surged significantly from 15.3% in the same period last year to 39.0%, as the Company’s business structure continues to upgrade toward higher-speed and higher-value-added solutions. With 800G silicon photonics modules entering the volume shipment stage—supporting maximum transmission distances of up to approximately two kilometers—the Company’s large-scale commercial application capabilities in silicon photonics technology have been further validated. During the reporting period, R&D expenses increased by 58.5% year-on-year to RMB67.8 million, raising its proportion of total revenue to 8.5%. These investments were primarily channeled into continuous R&D for high-speed optical interconnects and next-generation silicon photonics products, securing technical reserves for subsequent product iteration and commercialization. Multi-Dimensional Growth Drivers to Capture Long-Cycle AI Infrastructure Dividends The accelerated construction of AI data centers has driven a sustained surge in demand for high-speed optical interconnects. The global market for AI optical modules is projected to maintain a compound annual growth rate of approximately 30% over the next five years, unlocking long-term growth opportunities for the silicon photonics and high-speed optical interconnect industries. Leveraging its end-to-end technological capabilities spanning silicon photonics chip design to optical module manufacturing, and bolstered by the secured supply of 10 million DSP chips, the Company has successfully consolidated its supply chain advantages. On the product front, the Company’s 800G silicon photonics optical modules have achieved volume shipments, and 1.6T products are scheduled to enter large-scale mass production in the second half of 2026. Meanwhile, the Company is actively deploying next-generation high-speed interconnection solutions such as PCIe 6.0/7.0 silicon photonics AOCs and 3.2T/6.4T NPO/CPO products. On the capacity and manufacturing front, it continues to advance expansion and AI-powered smart manufacturing to further improve mass production efficiency and yield rates. On the client side, it is deepening domestic JDM cooperation while continuously breaking through major North American core customers. Looking back at the first half of 2026, multiple key milestones were densely delivered, and long-term momentum is set to be continuously released. Entering the second half of the year, the Company will persistently enhance its competitiveness across capacity, manufacturing processes, products, and clients, capturing the long-term growth opportunities of the high-speed optical interconnect industry. This inclusion in Stock Connect marks a new milestone for the Company to connect with a broader capital market and march toward long-term value growth. About Crealights Technology Co., Ltd. (1191.HK) Crealights Technology Co., Ltd. is a joint-stock company incorporated in the People's Republic of China with limited liability, whose shares are listed on the Main Board of The Stock Exchange of Hong Kong Limited (Stock Code: 1191.HK). Rooted in the forefront of optical communications, the Company focuses on the R&D, manufacturing, and sales of high-speed optical interconnection products, dedicated to providing high-performance and highly reliable optical communication solutions for global data centers, cloud computing, and telecommunication network customers. Led by its founder and CEO, Dr. Chaoyang Hu, the Company has established a solid market position and an exceptional industry reputation in the high-speed optical transmission field, underpinned by outstanding R&D innovation capabilities, rigorous quality management, and a comprehensive supply chain layout.
  11. AITECNOTECNO CAMON Slim 5G Launches: A 6.39mm Ultra-Slim Art Piece in Your Palm with Pro-Level CapabilitiesArtfully-created colorways, professional-level imaging, and practical AI — all housed in a 6.39mm yet durable body — TECNO, an innovative AI-driven technology brand, today unveiled the TECNO CAMON Slim 5G, a device that brings CAMON's imaging...
  12. FinanceCrealights Officially Included in Stock Connect, A New Capital Market Milestone for the AI Silicon Photonics Interconnect PioneerHONG KONG, Sept 7, 2026 - Crealights Technology Co., Ltd. (“Crealights” or the “Company”, Stock Code: 1191.HK) has been officially included as a constituent stock of the Hang Seng Composite Index, becoming eligible for the Stock Connect trading scheme starting today. Mainland investors can now trade the Company’s shares directly through the Stock Connect channels, which is expected to further broaden the Company’s investor base and enhance its share trading liquidity. This inclusion follows the Hang Seng Index Company's quarterly review results for the period ended June 30, 2026, announced on August 21, 2026. The inclusion deepens the Company’s connection with the onshore capital market, which is expected to attract greater long-term capital interest and provide more diversified capital market support for the Company’s long-term value growth. Continuous Financial Deliverables and Accelerated Product Structure Upgrades The Company released its post-listing interim results on August 28. During the reporting period, total revenue reached RMB798.5 million, representing a year-on-year increase of 14.4% and a half-on-half growth of 52.7%. The revenue contribution from silicon photonics products surged significantly from 15.3% in the same period last year to 39.0%, as the Company’s business structure continues to upgrade toward higher-speed and higher-value-added solutions. With 800G silicon photonics modules entering the volume shipment stage—supporting maximum transmission distances of up to approximately two kilometers—the Company’s large-scale commercial application capabilities in silicon photonics technology have been further validated. During the reporting period, R&D expenses increased by 58.5% year-on-year to RMB67.8 million, raising its proportion of total revenue to 8.5%. These investments were primarily channeled into continuous R&D for high-speed optical interconnects and next-generation silicon photonics products, securing technical reserves for subsequent product iteration and commercialization. Multi-Dimensional Growth Drivers to Capture Long-Cycle AI Infrastructure Dividends The accelerated construction of AI data centers has driven a sustained surge in demand for high-speed optical interconnects. The global market for AI optical modules is projected to maintain a compound annual growth rate of approximately 30% over the next five years, unlocking long-term growth opportunities for the silicon photonics and high-speed optical interconnect industries. Leveraging its end-to-end technological capabilities spanning silicon photonics chip design to optical module manufacturing, and bolstered by the secured supply of 10 million DSP chips, the Company has successfully consolidated its supply chain advantages. On the product front, the Company’s 800G silicon photonics optical modules have achieved volume shipments, and 1.6T products are scheduled to enter large-scale mass production in the second half of 2026. Meanwhile, the Company is actively deploying next-generation high-speed interconnection solutions such as PCIe 6.0/7.0 silicon photonics AOCs and 3.2T/6.4T NPO/CPO products. On the capacity and manufacturing front, it continues to advance expansion and AI-powered smart manufacturing to further improve mass production efficiency and yield rates. On the client side, it is deepening domestic JDM cooperation while continuously breaking through major North American core customers. Looking back at the first half of 2026, multiple key milestones were densely delivered, and long-term momentum is set to be continuously released. Entering the second half of the year, the Company will persistently enhance its competitiveness across capacity, manufacturing processes, products, and clients, capturing the long-term growth opportunities of the high-speed optical interconnect industry. This inclusion in Stock Connect marks a new milestone for the Company to connect with a broader capital market and march toward long-term value growth. About Crealights Technology Co., Ltd. (1191.HK) Crealights Technology Co., Ltd. is a joint-stock company incorporated in the People's Republic of China with limited liability, whose shares are listed on the Main Board of The Stock Exchange of Hong Kong Limited (Stock Code: 1191.HK). Rooted in the forefront of optical communications, the Company focuses on the R&D, manufacturing, and sales of high-speed optical interconnection products, dedicated to providing high-performance and highly reliable optical communication solutions for global data centers, cloud computing, and telecommunication network customers. Led by its founder and CEO, Dr. Chaoyang Hu, the Company has established a solid market position and an exceptional industry reputation in the high-speed optical transmission field, underpinned by outstanding R&D innovation capabilities, rigorous quality management, and a comprehensive supply chain layout.