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- IntelIntel’s U.S. Advanced Packaging Enables Next-Generation AI SemiconductorsCompanies: IntelAs AI demands unprecedented "brain power," the semiconductor industry is moving past the era of relying on single, massive chips. Advanced packaging is the essential craft of interconnecting multiple specialized chips together. This allows them to function as a single, powerful unit that runs faster handling the massive workloads of the future.Intel’s been doing advanced … The post Intel’s U.S. Advanced Packaging Enables Next-Generation AI Semiconductors appeared first on Newsroom.
- IntelIntel Completes RAMP-C Program, Accelerating Momentum for Secure EnclaveCompanies: IntelWhat’s New: Intel Foundry has completed the Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program. Launched in September 2021, the program supported development of domestic, leading-edge CMOS technology and manufacturing in the United States, establishing a foundation for expanded trusted domestic semiconductor manufacturing.“The collaboration between the DoW and Intel on the Trusted & Assured Microelectronics … The post Intel Completes RAMP-C Program, Accelerating Momentum for Secure Enclave appeared first on Newsroom.
- IntelIntel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI EraCompanies: IntelSANTA CLARA, Calif. & CHANGSHA, China — Intel Corporation and Lens Technology today announced a strategic collaboration focused on enabling new technologies for advanced semiconductor packaging. Through this work, the companies intend to explore opportunities to accelerate the development of glass substrate-based packaging solutions that can help enable higher performance, increased interconnect density, and improved … The post Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era appeared first on Newsroom.
- IntelIntel Reports Second-Quarter 2026 Financial ResultsCompanies: IntelIntel Corporation’s second-quarter 2026 earnings news release and presentation are available on the company’s Investor Relations website. The earnings conference call for investors begins at 2 p.m. PDT today; a public webcast will be available at www.intc.com.More: Earnings News Release | Earnings Call Comments from CEO Lip-Bu Tan and CFO Dave Zinsner The post Intel Reports Second-Quarter 2026 Financial Results appeared first on Newsroom.
- IntelIntel and Fortinet Collaborate to Advance Cybersecurity Innovation and Strengthen Global Supply Chain ResilienceCompanies: IntelFortinetSANTA CLARA AND SUNNYVALE, Calif. – July 21, 2026 – Intel Corporation (NASDAQ: INTC) and Fortinet (NASDAQ: FTNT), today announced a strategic collaboration to develop Fortinet Security Processor 6 (SP6). Expanding a long-standing relationship between the two companies, this collaboration combines Fortinet’s proprietary, purpose-built security processor expertise with Intel’s advanced design, packaging, and manufacturing capabilities … The post Intel and Fortinet Collaborate to Advance Cybersecurity Innovation and Strengthen Global Supply Chain Resilience appeared first on Newsroom.