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High Density Packaging User Group Announces Nittobo Membership


High Density Packaging User Group (HDP) is pleased to announce that Nittobo has become a member.

High Density Packaging User Group (HDP) is pleased to announce that Nittobo has become a member. 

"We are honored to join HDP User Group and collaborate with world-leading companies in the electronics packaging industry," said Ken Fukui, Product Development Group Manager, Technical Development Department, Electronic Materials Business Division at Nittobo. "As a pioneer in high-performance glass fiber technologies, including our low-dielectric NE/NER™-Glass and low-thermal-expansion T-Glass, Nittobo is committed to driving advancements in next-generation semiconductor packages and high-speed infrastructure. We look forward to contributing our material expertise to HDP's collaborative projects to address key industry challenges together."

"I am delighted to extend a warm welcome to Nittobo to the HDP community, joining the esteemed membership dedicated to the evaluation of advanced electronic and material technologies," said Larry Marcanti, Executive Director of HDP User Group. "HDP fosters a distinctive environment where industry leaders can collaborate to address shared challenges and propel innovation. We eagerly anticipate partnering with Nittobo and contributing to the development of practical solutions that fortify the electronics ecosystem and supply chain, particularly for high-speed, high-frequency applications."

About Nittobo

Founded in 1923, Nittobo is a pioneer that successfully commercialized glass fiber for the first time in the world. Through its Electronic Materials Business Division, the company manufactures advanced glass fibers leveraging proprietary composition technologies—including T-Glass with low thermal expansion and high elasticity, as well as NE-Glass and NER™-Glass with superior low-dielectric properties. Commandingly holding a top global market share, Nittobo's materials play a vital role in curbing substrate warp and enhancing high-speed signal transmission for advanced semiconductor packages and AI infrastructure. As an indispensable industry partner, Nittobo's membership in HDP will undoubtedly reinforce the consortium's foundation for collaborative innovation.

About HDP

HDP User Group (www.hdpug.org), a global research and development organization based in Round Rock, Texas, is dedicated to reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly. This international industry-led group organizes and conducts R&D programs to address the industry's technical issues, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. HDP User Group maintains additional offices in Singapore and Yokohama, Japan.

For more information, visit the HDP User Group on the internet at www.hdpug.org or contact Madan Jagernauth at [email protected], phone number +1 561.501.1567.

Media Contact

Madan Jagernauth, HDP User Group International, 1 561-501-1567, [email protected], https://hdpusergroup.org/

SOURCE HDP User Group International