美国银行：ASML高数值孔径技术势头正盛
格隆汇9月8日｜美国银行分析师DidierScemama在研究报告中表示，在台积电和三星电子表示计划未来几年大规模采用其高数值孔径技术后，ASMLHolding的先进芯片制造设备势头正盛。Scemama指出，这些公告共同表明该技术正从开发阶段进入逻辑和存储芯片领域的更广泛制造应用。同时，ASML与台积电合作向更大尺寸光掩模转型的公告同样利好，应能提高生产率、降低芯片制造成本并消除拼接限制。ASML...
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